Abstract: A method for processing films attached on two sides of a glass substrate is disclosed, which comprises the steps of: providing a laser machining device capable of performing a patterning process whereas the transmission of a laser beam for the patterning process is below 50%; providing a glass substrate having its two sides being attached by films in respective; and exciting the laser machining device for projecting the laser beam onto the films of the glass substrate for patterning the films with predefined patterns.

Abstract: A semiconductor composition material conveyer module, which includes at least one horizontal conveyer unit and at least one vertical conveyer unit arranged with the at least one horizontal conveyer unit to form an automatic production line for conveying semiconductor composition material for processing. A displacement sensor is triggered when semiconductor composition material is delivered from the horizontal conveyer unit at one production line to the matched vertical conveyer unit, thereby causing the matched vertical conveyer unit to carry semiconductor composition material to a horizontal conveyer unit at a second production line for further processing.

Abstract: A reel section having hooks is provided. The reel section includes a hub and a side member which attaches to the hub. The hub has circumferential wall projected laterally from the side member, and a base wall joined to the circumferential wall. The base wall has a plurality of hooks extended in a circumferential direction and each base wall has a slot located about each hook. Each hook has a generally flat first section, a second section joined to the first section and a hook end projected from the second section. The second section projects laterally from the plane of the first section. The hook is adapted to cooperate with the hook of another reel section to form a reel assembly.