Patents Assigned to GLOBAL POWER DEVICES COMPANY
  • Publication number: 20140264382
    Abstract: Methods, systems, and devices are disclosed for thermal processing of silicon carbide semiconductor devices. In one aspect, a method for fabricating a silicon carbide semiconductor device includes forming a thin epitaxial layer of a nitrogen and phosphorous co-doped SiC material on a SiC epitaxial layer formed on a SiC substrate, and thermally growing an oxide layer to form an insulator material on the nitrogen and phosphorous co-doped SiC epitaxial layer, in which the thermally growing the oxide layer results in at least partially consuming the nitrogen and phosphorous co-doped SiC epitaxial layer in the oxide layer to produce an interface including nitrogen and phosphorous between the SiC epitaxial layer and the oxide layer.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Global Power Device Company
    Inventors: Michael MacMillan, Utpal K. Chakrabarti
  • Publication number: 20140167073
    Abstract: Methods, systems, and devices are disclosed for implementing high power circuits and semiconductor devices. In one aspect, a method for fabricating a silicon carbide semiconductor device includes forming a thin epitaxial layer of a nitrogen doped SiC material on a SiC epitaxial layer formed on a SiC substrate, and thermally growing an oxide layer to form an insulator material on the nitrogen doped SiC epitaxial layer, in which the thermally grown oxide layer results in at least partially consuming the nitrogen doped SiC epitaxial layer in the oxide layer to produce an interface including nitrogen between the SiC epitaxial layer and the oxide layer.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 19, 2014
    Applicant: GLOBAL POWER DEVICE COMPANY
    Inventor: Michael MacMillan
  • Publication number: 20140145211
    Abstract: Methods, systems, and devices are disclosed for implementing high power circuits and semiconductor devices. In one aspect, a method for fabricating a silicon carbide (SiC) device includes forming a thin layer of a protection material over a SiC substrate, in which the protection material has a lattice constant that substantially matches a lattice constant of SiC and the thin layer has a thickness of less than a critical layer thickness for the protection material over SiC to form a uniform interface between the protection material and SiC, forming a layer of an insulator material over the thin layer of the protection material, and forming one or more transistor structures over the insulator material.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 29, 2014
    Applicant: GLOBAL POWER DEVICES COMPANY
    Inventor: Utpal K. Chakrabarti