Abstract: A continuity testing and cleaning fixture includes a continuity test area disposed on a portion of a first surface of the fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten. The continuity testing and cleaning fixture may be used in a method involving contacting at least two conductive elements of a probe card with a continuity test area of a continuity testing and cleaning fixture, wherein the continuity test area comprises an upper region comprising at least 99.99 wt % tungsten; determining an electrical resistance between the at least two conductive elements; and cleaning the at least two conductive elements with at least one cleaning zone of the continuity testing and cleaning fixture in response to determining the electrical resistance to be above a first threshold.

Abstract: At least one method, apparatus and system disclosed herein involves forming trench in a gate region, wherein the trench having an oxide layer to a height to reduce or prevent process residue. A plurality of fins are formed on a semiconductor substrate. Over a first portion of the fins, an epitaxial (EPI) feature at a top portion of each fin of the first portion. Over a second portion of the fins, a gate region is formed. In a portion of the gate region, a trench is formed. A first oxide layer at a bottom region of the trench is formed. Prior to performing an amorphous-silicon (a-Si) deposition, a flowable oxide material is deposited into the trench for forming a second oxide layer. The second oxide layer comprises the flowable oxide and the first oxide layer. The second oxide layer has a first height.

Abstract: At least one method, apparatus and system disclosed herein involves forming a sigma shaped source/drain lattice. A fin is formed on a semiconductor substrate. A gate region is formed over the fin. In a source region and a drain region adjacent bottom portions of the fin, a first recess cavity is formed in the source region, and a second recess cavity is formed in the drain region. The first and second recess cavities comprise sidewalls formed in an angle relative to a vertical axis. Portions of the first and second recess cavities extend below the fin. In the first recess cavity, a first rare earth oxide layer is formed, and in the second recess cavity, a second rare earth oxide layer is formed.

Abstract: A method, apparatus, and manufacturing system are disclosed herein for a vertical field effect transistor patterned in a self-aligned process. A plurality of fins is formed. A gate structure is formed on at least a first side and a second side of a lower portion of each fin. A spacer is formed on at least a first side and a second side of an upper portion of each fin. At least one layer is formed above the substrate and between the fins. An opening is formed in the at least one layer between the fins by an etching process. The spacer protects the gate structure during the etching process.

Abstract: Embodiments of the present invention provide a semiconductor structure having a strain relaxed buffer, and method of fabrication. A strain relaxed buffer is disposed on a semiconductor substrate. A silicon region and silicon germanium region are disposed adjacent to each other on the strain relaxed buffer. An additional region of silicon or silicon germanium provides quantum well isolation.

Abstract: A method provides a structure having a FinFET in an Rx region, the FinFET including a channel, source/drain (S/D) regions and a gate, the gate including gate metal. A cap is formed over the gate having a high-k dielectric liner and a core. Trench silicide (TS) is disposed on sides of the gate. The TS is recessed to a level above a level of the gate and below a level of the cap. An oxide layer is disposed over the structure. A CB trench is patterned into the oxide layer within the Rx region to expose the core and liner at an intermediate portion of the CB trench. The core is selectively etched relative to the liner to extend the CB trench to a bottom at the gate metal. The CB trench is metalized to form a CB contact.

Abstract: At least one method, apparatus and system disclosed involves a memory device having a memory cell comprising NMOS only transistors. An SRAM bit cell comprises a first pass gate (PG) NMOS transistor coupled to a first bit line signal and a word line signal; a second PG NMOS transistor coupled to a second bit line signal and the word line signal; a first pull down (PD) NMOS transistor operatively coupled to the first PG NMOS transistor; a second PD NMOS transistor operatively coupled to the second PG NMOS transistor; a first pull up (PU) NMOS transistor operatively coupled to the first PD NMOS transistor; and a second PU NMOS transistor operatively coupled to the second PD NMOS transistor. Each of the back gates of the first and second PU NMOS transistors are coupled to a predetermined voltage signal for biasing the first and second PU NMOS transistors.

Abstract: Wiring structures with dummy metal features and methods of manufacture are disclosed. A structure includes a metal wiring structure, and dummy metal features in electrical and direct physical contact with the metal wiring structure in a same plane as the metal wiring structure. The dummy metal features do not change a resistance of the metal wiring structure and are remote from other structures.

Abstract: Systems and methods are provided for managing storage cache resources among all servers within the cluster storage environment. A method includes partitioning a main cache of a corresponding node into a global cache and a local cache, sharing each global cache of each node with other ones of the nodes of the multiple nodes, and dynamically adjusting a ratio of an amount of space of the main cache making up the global cache and an amount of space of the main cache making up the local cache, based on access latency and cache hit over a predetermined period of time of each of the global cache and the local cache.

Abstract: A bonding layer of a first wafer article is thermally treated and a bonding layer of a second wafer article is thermally treated in accordance with first and second process parameters, respectively prior to bonding the first wafer article with the second wafer article. First and second grid distortion in the first and second wafer articles is measured and a difference is determined between the first and second grid distortions. A prediction is made for maintaining the difference within a prescribed tolerance. At least one of the first process parameters and the second process parameters is conditionally varied in accordance with the prediction. The thermal treating of the first and second wafer articles can then be performed with respect to another pair of the first and second wafer articles prior to bonding to one another through their respective bonding layers.

Abstract: In one exemplary embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, said operations including: depositing a first layer having a first metal on a surface of a semiconductor structure, where depositing the first layer creates a first intermix region at an interface of the first layer and the semiconductor structure; removing a portion of the deposited first layer to expose the first intermix region; depositing a second layer having a second metal on the first intermix region, where depositing the second layer creates a second intermix region at an interface of the second layer and the first intermix region; removing a portion of the deposited second layer to expose the second intermix region; and performing at least one anneal on the semiconductor structure.