Abstract: The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.

Abstract: Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal foils to expose the insulating plate so that a plurality of stripes are arranged on both sides of the insulating plate in parallel at constant intervals, wherein the stripes expose the insulating plate at constant widths; and a third step of cutting in direction in parallel with the stripes and in direction in vertical with the stripes along one edges of the stripes to complete the gap supporter.

Abstract: The substrate gap supporter (30) according to one embodiment of the present invention comprises a body (31) having a hexahedron shape and made of an insulator, metal foils (32a) and (32b) installed on opposite side surfaces of the body (31) to expose the upper portions of both side surfaces and cover the lower portions of both side surfaces, and a substrate (210) attached to the bottom surface of the body (31). According to the present invention, the gap supporter can be made through an automated process, thus precisely controlling size. Since the gap supporter is attached to the surface of the substrate, there is little possibility for a height difference to occur. And also, because the gap supporter can be installed in an automated process, it is suitable for a mass production process.

Abstract: According to the present invention, there is provided a diode package in which a diode chip is sealed by a molding compound and a lead wire connected to the diode chip is led outside the molding compound, wherein the lead wire is divided into an upper lead wire and a lower lead wire, both lead wires each being formed in a long, flat plate and having a first stage and a second stage, both stages being opposite from each other, the upper side of the diode chip is attached to the lower side of the first stage of the upper lead wire, the lower side of the diode chip is attached to the upper side of the first stage of the lower lead wire, and the second stage of the upper lead wire and the second stage of the lower lead wire are led out in the lateral direction of the molding compound.

Abstract: The substrate gap supporter (30) according to one embodiment of the present invention comprises a body (31) having a hexahedron shape and made of an insulator, metal foils (32a) and (32b) installed on opposite side surfaces of the body (31) to expose the upper portions of both side surfaces and cover the lower portions of both side surfaces, and a substrate (210) attached to the bottom surface of the body (31). According to the present invention, the gap supporter can be made through an automated process, thus precisely controlling size. Since the gap supporter is attached to the surface of the substrate, there is little possibility for a height difference to occur. And also, because the gap supporter can be installed in an automated process, it is suitable for a mass production process.

Abstract: Disclosed is a diode package, wherein an upper lead wire and a lower lead wire are each formed in a long and flat plate and each have a first stage and a second stage, both stages being opposite from each other, the upper side of the diode chip is attached to the lower side of the first stage of the upper lead wire, the lower side of the diode chip is attached to the lower side of the first stage of the upper lead wire, and the second stage of the upper lead wire and the second stage of the lower lead wire are led out in the lateral direction of the molding compound. Furthermore, the first stage of the upper lead wire has a hemispherical contact groove which protrudes downward, and the hemispherical contact groove has a through hole in the center thereof.