Abstract: A heat dissipation device includes a heat absorbing member being provided with a first accommodating chamber for accommodating a working medium and a mounting hole in communication with the first accommodating chamber; and a valve installed in the mounting hole. The valve is adjustable between a first state and a second state to change the first accommodating chamber between a closed state and an open state. When the first accommodating chamber is in the open state, the first accommodating chamber is in fluid communication with outside so that the working medium can be injected into or discharged from the first accommodating chamber, so as to adjust the amount of the working medium in the first accommodating chamber. Thus, the heat dissipation device is applicable to various applications with different heat dissipating requirements.

Abstract: A heat dissipation device for an LED light strip of a television is provided, including a heat dissipation substrate and a heat dissipation cover plate. The heat dissipation substrate includes a mounting plate and a heat dissipation bottom plate connected to the mounting plate, the mounting plate is provided with a clamping opening for mounting the LED light strip. The heat dissipation cover plate is fixed on the heat dissipation bottom plate, and a cavity configured to be filled with a refrigerant working medium is defined between the heat dissipation cover plate and the heat dissipation bottom plate. A liquid injection port is provided on the heat dissipation bottom plate or the heat dissipation cover plate, which is in communication with the cavity and is used for filling the cavity with the refrigerant working medium.

Abstract: A heat dissipation device for an LED light strip of a television is provided, including a heat dissipation substrate and a heat dissipation plate. A mounting surface of the heat dissipation substrate is provided with a clamping opening for mounting the light strip and a mounting groove extending along a length direction. The light strip may be arranged on the mounting surface along the length direction through the clamping opening. The heat dissipation plate is filled with a refrigerant working medium, one side of the heat dissipation plate is fixed in the mounting groove, and the heat dissipation plate extends along the length direction of the heat dissipation substrate.

Abstract: A heat dissipation device includes a heat absorbing member being provided with a first accommodating chamber for accommodating a working medium and a mounting hole in communication with the first accommodating chamber; and a valve installed in the mounting hole. The valve is adjustable between a first state and a second state to change the first accommodating chamber between a closed state and an open state. When the first accommodating chamber is in the open state, the first accommodating chamber is in fluid communication with outside so that the working medium can be injected into or discharged from the first accommodating chamber, so as to adjust the amount of the working medium in the first accommodating chamber. Thus, the heat dissipation device is applicable to various applications with different heat dissipating requirements.