Abstract: A composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two properties sides thereof. The baseboard uses a porous ePTFE film with excellent dielectric as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard. The dielectric constant of the high-frequency circuit baseboard and prepreg is isotropic in both X and Y directions. The thickness of the prepreg can be regulated by employing porous ePTFE films with a different thickness, which avoids cracking.

Abstract: The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil.

Abstract: The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.

Abstract: The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.

Abstract: The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent.

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs.

Abstract: The present invention relates to a cyanate ester resin composition and a prepreg, a laminated material and a metal clad laminated material made therefrom. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: Wherein, n represents an integer between 1 and 50. The cyanate ester resin composition of the present invention has good heat resistance and flame retardance. The laminated material and the metal clad laminated material made from the prepreg that is made from the cyanate ester resin composition, still have good flame retardance and low coefficients of thermal expansion in X, Y directions, without using halogen-containing compounds or phosphorus-containing compounds as the flame retardant, so they are fit for making a substrate material for high density PCB.

Abstract: The present invention relates to a cyanate ester resin composition and a prepreg, a laminated material and a metal clad laminated material made therefrom. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: wherein, R and R1 represent hydrogen, alkyl, aryl or aralkyl, and n represents an integer between 1 and 50. The cyanate ester resin composition of the present invention has good mechanical properties, heat resistance and flame retardance. The laminated material and the metal clad laminated material made from the prepreg that is made from the cyanate ester resin composition, still have good flame retardance, low coefficients of thermal expansion in X, Y directions, and good mechanical properties, without using halogen-containing compounds or phosphorus-containing compounds as the flame retardant.

Abstract: The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.

Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises: (A) epoxy resin containing two or over two epoxy groups, (B) active ester curing agent, and (C) phosphate salt compound. The epoxy resin composition of the present invention adopts epoxy resin with specific molecular structure, which has comparatively high functionality, so the cured products have high glass transition temperature and low hydroscopic property; active ester is adopted as the curing agent to make full use of the advantages that polar groups will not be produced when the active ester reacts with the epoxy resin; the prepreg and copper clad laminate made therefrom of the present invention can achieve halogen-free flame retardance, and meanwhile have excellent dielectric properties and good resistance to humidity and heat.

Abstract: Disclosed is a composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two sides thereof.

Abstract: The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.

Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.

Abstract: The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards.

Abstract: The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent.

Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of which the melt viscosity is not more than 0.5 Pa·s under the temperature of 150 ° C.; (B) phenolic resin, of which the structure is as shown in the formula 1: wherein, n represents an integer of 0-10. The epoxy resin composition of the present invention can provide the prepreg and copper clad laminate made therefrom with high glass transition temperature, high heat resistance, low expansion coefficient and low moisture absorption, which can meet demands of high reliability of high density multi-layer PCBs.

Abstract: A composite material, a high-frequency circuit substrate made from the composite material, and a method of making the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a butadiene styrene copolymer resin with a molecular weight less than 11,000 containing more than 60 percent of vinyl, a polybutadiene resin with polarity groups containing more than 60 percent vinyl, and a maleic anhydride grafted polybutadiene styrene copolymer with a molecular weight of more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material permits easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for the processing operation. The composite material is suitable for making the circuit substrate.

Abstract: The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc.

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil.