Patents Assigned to Halo Electronics, Inc.
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Patent number: 6662431Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.Type: GrantFiled: February 5, 2002Date of Patent: December 16, 2003Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
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Patent number: 6344785Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.Type: GrantFiled: August 6, 1997Date of Patent: February 5, 2002Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
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Patent number: 6320489Abstract: The electronic surface mount package according to the present invention includes a one piece construction package having end walls, a side wall and an open bottom; a plurality of toroid transformers carried within the package by a soft silicone material wherein the toroid transformers each have wires wrapped thereon; a plurality of terminal pins molded within and extending from the bottom of the package wherein each of the pins extend through a bottom portion of the side wall and have a notched post upon which the wires from said transformers are wrapped and soldered thereon, respectively; and wherein the end walls have a first height H1 to form a standoff or safe guard between the foot seating plane of the package and the terminal pins; and wherein the outer portion of the side wall extends between the end walls such that the side wall has a second height H2 which is less than said first height H1.Type: GrantFiled: November 24, 1997Date of Patent: November 20, 2001Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
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Patent number: 6297721Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.Type: GrantFiled: November 24, 1997Date of Patent: October 2, 2001Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Tsang Kei Sun, Peter Loh Hang Pao, Robert Loke Hang Lam
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Patent number: 6297720Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.Type: GrantFiled: December 27, 1996Date of Patent: October 2, 2001Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Tsang Kei Sun, Peter Loh Hang Pao, Robert Loke Hang Lam
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Patent number: 6171151Abstract: An isolation module for an RJ-45 modular jack provides isolation and noise control and reduction for the RJ-45 modular jack. The RJ-45 modular jack includes a front surface having an opening for receiving a corresponding modular plug. The RJ-45 modular jack further includes a plurality of electrical fingers arranged in a spring bias fashion within the opening in the front surface for making electrical contact with a modular plug. The RJ-45 modular jack includes a series of sockets or slots along the back surface of said modular jack such that the electrical fingers extend to the back side of the modular jack and terminate in a reverse bent fashion to form a socket or clip portion within a respective socket or slot.Type: GrantFiled: February 6, 1998Date of Patent: January 9, 2001Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hung Pao, Robert Loke Hang Lam, Tsang Kei Sun
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Patent number: 5656985Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.Type: GrantFiled: August 10, 1995Date of Patent: August 12, 1997Assignee: Halo Electronics, Inc.Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hong Pao, Robert Lake Hang Lam, Tsang Kei Sun