Abstract: The invention relates to a process for the detection of malfunctions, in particular the detection of breakage of a wire in a wire sawing device. The process consists in applying an alternating signal to the layer of wires (4) of the sawing device and measuring the variations of voltage or current at the terminals of the layer of wires. In a modification, there are measured variations of voltage induced by the layer of wires forming a primary circuit in an antenna (9) forming the secondary circuit of a resonant system. The invention also has for its object the device for practicing the process of the invention.

Abstract: The invention relates to a process for the detection of malfunctions, in particular the detection of breakage of a wire in a wire sawing device. The process consists in applying an alternating signal to the layer of wires (4) of the sawing device and measuring the variations of voltage or current at the terminals of the layer of wires. In a modification, there are measured variations of voltage induced by the layer of wires forming a primary circuit in an antenna (9) forming the secondary circuit of a resonant system. The invention also has for its object the device for practicing the process of the invention.

Abstract: In the sawing process and device according to the invention, the pieces to be sawed are mounted on at least one support table and caused to bear against a layer of wires. Inclination structure in the form of wedges or pieces for angular adjustment by pivoting and blocking, are provided to mount the pieces obliquely with angles of inclination between one of their prismatic surfaces and a horizontal working plane. There is thus obtained a precise beginning of sawing with sawed slices of equal thickness and a careful end of cutting without chipping.

Abstract: A sawing device includes a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). An oscillating device (23) produces a relative reciprocating movement between the workpiece and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that the oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23).

Abstract: The wire sawing device includes two external wire guide cylinders (1, 2) having a diameter (D1) smaller than that (D2) of the two internal wire guide cylinders (3, 4). The external wire guide cylinders are driven in rotation by a power drive to cause the movement of the wires of a layer of wires (6), whilst the internal wire guide cylinders (3, 4) ensure only the function of guidance without driving the wires of the layer of wires. By the separation of the drive function from the guide function of the wire, substantial heating of the guiding wire guide cylinders can be avoided, which permits obtaining sawed pieces of high precision without undulations.

Abstract: A slicing center includes a first structure (23) to carry out operations (24) necessary for the production of processed slices in trays or packaged, from pieces to be sliced. These operations (24) are controlled and interconnected by a second structure (25) so as to form subgroups (26) consisting of a positioning unit, a slicing unit, a processing unit and a final treatment unit. These subgroups (26) are in turn interconnected by third structure (27) comprising devices for storing and devices for handling and transportation of the slices, thereby to form a chain of transfer in which all the elements are compatible and interconnected.

Abstract: The invention concerns a wire sawing device comprising at least a support table (35) bearing a piece to be sawed (34) urged against the set of wires layer (26, 27) two outer wire-guide rolls (10, 11) powered by motors (14, 15) and at least two inner wire-guide rolls (16, 17). The wire (18) is wound on the wire-guide rolls so as to constitute between the inner wire-guide rolls (16, 17) two cross sets of wires (26, 27) whereof the projecting wires are parallel and at a distance from a first space (31) and so as to be returned by the outer wire-guide rolls (10, 11) whereon is provided a second space (30) twice the first space (31). Such an arrangement enables a balanced distribution of forces on the inner wire-guides (16, 17), the surfaces of the sawed slices to be perfectly parallel, the shearing forces on the piece to be sawed (34) to be reduced, a decrease in the cutting pressure, a greater cutting speed and to improve the precision of the resulting slices.

Abstract: A slicing device using yarn includes at least two yard-guide cylinders on which the yarn is wound and by which the yarn can be moved with a reciprocating or continuous motion pressed against a piece to be sliced fixed on a supporting table. The yarn is wound on the yarn-guide so as to form at least two layers of yarn intersecting with one or several non-null intersecting angles (&bgr;) and so as to pass in a straight line from one cylinder to the other. The angle of inclination between the moving direction of the piece to be sliced and a line perpendicular to the plane of the yarn cylinder axes is adjustable so as to obtain strictly parallel slices. The intersection of the yarn layers improves the quality of slices obtained by facilitating the subsequent mechanical treatment operations of surfaces with crossed faults. Moreover, the angle of the yarn layers reduces the shearing and torsional stresses on the support of the piece to be sliced when the slices are being cut.

Abstract: The cutting device includes a web (2) of parallel wires capable of an alternating or a continuous motion while pressing against a work piece (1) fixed to a support table (3). The device includes angle changing devices (13, 16) for realigning the wires relative to the support table.

Abstract: The sawing device comprises a layer of parallel wires (2) moving with alternating or continuous movement whilst bearing against a piece (1) to be sawed fixed on a support table (3), the whole being maintained by a frame (14). The device comprises wire guide cylinders (4) having an interchangeable surface constituted by removable segments (6) fixed mechanically and/or by cementing. The removable segments (6) are pre-incised or not, with grooves (9). Said wire guide cylinders (4) need accordingly not be taken out of the frame (14) for the changing operation of the removable segments (6) and/or of the regeneration of the surface.

Abstract: The process and device (1) for positioning several single crystals (2) on a support (3) for their simultaneous cutting in directions well defined relative to the crystal structure of each single crystal; they avoid the adjustment in the machine and minimize the cutting time by providing a positioning outside the machine about angles of rotation (d,g) obtained mathematically from measured and/or given data and which position each geometric single crystal in a plane perpendicular to the cutting direction (z'") whilst bringing the cutting plane of each single crystal (2) parallel to the cutting direction of the machine. The device for practicing the process comprises a frame (5), a gripping device (8) mounted rotatably on the frame and carrying single crystals (2) and a rotatable plate (11) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and to the cutting machine.

Abstract: A sawing device comprises a layer of parallel wires (8) which move with reciprocal or continuous movement whilst bearing against a member (9) to be sawed fixed to a support table (10). The wire comes from a management region (41a) of the wire, constituted by two spools of wire, one (2a) a payout spool and the other (14a) a take-up spool, which do not rotate, but which have a revolving spooling and unspooling member (42) about the spools permitting rendering the sawing device independent of the mass of the spools of wire (2a, 14a) and hence of the length of the wire.

Abstract: Sawing device comprising a layer of parallel wires (2) moving with alternating or continuous movement bearing against a piece (1) to be sawed fixed on a support table (3), the whole being maintained by a frame (7). The device comprises, removably or not, an in situ cutting mechanism for the grooves (11) on the surface of the wire guide cylinders (4) forming the support of the layer of wires (2). It is accordingly not necessary to dismount and withdraw the wire guide cylinders (4) from the frame (7) for the cutting operation of the grooves (11), which permits higher productivity and increased cutting precision.