Patents Assigned to HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
  • Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
    Patent number: 11884802
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: January 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae