Patents Assigned to Heat Pump Technologies, LLC
  • Patent number: 8763424
    Abstract: Disclosed are embodiments of a subcooling heat exchanger adapted for evaporator distribution lines operating in a closed refrigeration circuit. Embodiments include heat exchangers having a first flow path upstream from a metering device carrying a working fluid at a higher temperature exchanging heat with the working fluid downstream from the metering device in one or more separate second lower temperature distribution flow paths leading to a downstream evaporator.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: July 1, 2014
    Assignee: Heat Pump Technologies, LLC
    Inventor: Luther D. Albertson