Abstract: A method and apparatus of forming a battery enabled flexible circuit. The invention includes forming a first insulating layer and positioning a battery on the first insulating layer, the battery having at least a first and a second terminal. A second insulating layer is then formed on the first insulating layer and the battery. The second insulating layer has vias that are in electrical contact with at least one of the first and the second terminals.

Abstract: A method and apparatus of forming a battery enabled flexible circuit. The invention includes forming a first insulating layer and positioning a battery on the first insulating layer, the battery having at least a first and a second terminal. A second insulating layer is then formed on the first insulating layer and the battery. The second insulating layer has vias that are in electrical contact with at least one of the first and the second terminals.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: A test probe for a high-frequency device having an electronic circuit with two or more contact regions. The test probe comprises two or more signal probe tips. Each signal probe tip has a contact surface area for contacting one of the contact regions of the device. A ground probe has a ground contact surface with a surface area substantially greater than the contact surface area of the one signal probe tip for contacting another one of the contact regions of the electronic circuit. The ground probe is positioned between at least two of the signal probes.

Abstract: Hearing aids improve not only the hearing, but the lives of millions. Unfortunately, far too many sufferers of hearing loss forego the benefits of hearing aids because of size and cost of the devices. To address this need, the present inventor devised hearing-aid circuit modules that use folded flexible circuits. The modules save space and reduce the cost of manufacturing hearing aids.

Abstract: Radio-frequency identification (RFID) devices are used in a variety of applications to facilitate the identification and tracking of people, objects, and animals. One problem with RFID devices or tags concerns manufacturing cost. Specifically, some tag designs use an integrated-circuit chip requiring three external connections, instead of two as do many other designs. Accordingly, the present inventor devised a unique RFID module which uses a three-terminal integrated circuit and two capacitors, but only requires two external leads. One exemplary embodiment of the module includes two external terminals for connection to an antenna coil and an internal terminal for connection to a center-tap of a dual (center-tapped) capacitor. Other aspects of the invention include subcomponents of the module and methods of tag assembly using the module.

Abstract: A low-voltage wide band micro electrical mechanical (MEM) switch. The low-voltage MEM switch comprises a contact bridge. A microstrip has an impedance of about 50 Ohms, first and second portions, and a gap defined between the first and second portions. A cantilever arm supports the contact bridge. The cantilever arm has an end portion, an open state, and a closed state. The contact bridge is spaced from the microstrip at a distance of about 12 &mgr;m or greater when the cantilever arm is in the open state. The contact bridge provides electrical communication between the first and second portions of the microstrip when the cantilever arm is in the closed state. An electrically conductive coil opposes the first end, wherein the electrically conductive coil moves the cantilever arm from the open state to the closed state when a voltage of about 5 Volts or less are applied across the electrically conductive coil. A housing encloses the cantilever arm, microstrip, and electrically conductive coil.

Abstract: Hearing aids improve not only the hearing, but the lives of millions. Unfortunately, far too many sufferers of hearing loss forego the benefits of hearing aids because of size and cost of the devices. To address this need, the present inventor devised hearing-aid circuit modules that use folded flexible circuits. The modules save space and reduce the cost of manufacturing hearing aids.

Abstract: An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.

Abstract: An apparatus for processing a high-frequency electrical signal. The apparatus comprises a circuit carrier and an electrical circuit mounted on the circuit carrier. The electrical circuit processes a signal within a predetermined frequency range, the predetermined fundamental frequency range having a low end in the range being about 1 GHz or higher. An encapsulent material encapsulates at least a portion of the electrical circuit. The circuit carrier, electrical circuit, and encapsulent material form a package having resonant frequencies. The resonant frequencies are outside the predetermined frequency range.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.

Abstract: A high density circuit module construction uses a flex circuit attached to a substrate and folded over on it to provide higher packaging density while providing an increase in the surface area available for I/O pads. A substrate has components such as ICs mounted on one surface, and module I/O pads on the opposite surface. This surface also provides interconnects for the flex circuit. The flex circuit has one portion attached to the interconnect pads on one surface of the substrate. Another portion of the flex circuit folds around the substrate and is attached to the other side of the substrate. The surface area of this portion of the flex circuit provides in additional surface area for mounting circuit components, within essentially the same footprint area as the substrate. This module construction provides a higher density than prior art constructions, while providing a larger, unobstructed area for the I/O pads, which simplifies connecting the module into a larger assembly.

Abstract: An improved circuit module construction for mounting and interconnecting electronic components to substrates, which is applicable to mounting a wide variety of electronic components and conductors, including inverted or `flip chip` mounted integrated circuits. The components are mounted to the substrate with a sandwiched non-conductive polymer layer which acts as the bonding agent and underfill. The substrate and underfill have apertures aligned with signal traces on the substrate and the contacts of the component and conductive polymer is injected through the apertures to fill the area between the substrate contacts and the component contacts, to secure good electrical connection. In one embodiment the non-conductive polymer is printed on the contact side of the substrate with gaps for the contacts. In another embodiment B-staged non-conductive polymer is coated on the non-contact side of the substrate, prior to forming contact apertures and mounting of components.

Abstract: Improved edge terminals for electronic circuit modules such as single- or multi-chip modules and hybrid circuits, and methods of making the edge terminals are disclosed. The improved edge terminals are formed on the edges of the modules, where they do not take up appreciable surface area from the module, and are formed of heat resisting metal and are of larger size as compared to conventional surface terminal pads which simplifies making connections to the module. In one embodiment, ends of pins are inserted in holes in a substrate along lines which will be the edges of the finished modules. After encapsulating in epoxy, the substrate is cut along the lines to bisect the pins, leaving the halves of the pins as embedded terminals flush with the edge of the module. In another embodiment, terminals are formed by attaching the terminal pieces to pads on the substrate, either in the form of widened zones in a grid structure, or an array of terminal plates.

Abstract: A cordless light pen for use with a cathode ray tube display screen as a data input for a digital computer. Contained within the exterior barrel of the pen is a depressible tip having a core made from a plastic which has been treated and whose index of refraction causes light entering in a direction parallel to the longitudinal axis of the core to pass through. The other end of the tip is operatively disposed relative to a light sensor. Also contained within the barrel of the cordless pen is a circuit card containing circuitry for amplifying, filtering and shaping the signals from the light sensor and to discriminate between signals due to the CRT sweep in the field of view of the tip and ambient noise. The so-called "hits" occasioned by the passage of the CRT beam past the tip member when it is depressed cause an IR LED to be energized to produce a directed beam of IR energy. The IR energy is transmitted to a receiver positioned to detect it, provided the light pen is held on the face of the CRT screen.

Abstract: A compact document reading station for transporting a document and sensing indicia carried on the document. First and second substantially identical box-like housing halves, each with four sides, a generally closed bottom and an open top, contain an in-line arrangement of a motor and a drive roller powered by that motor as well as an off-set driven pinch roller. The rollers which partially extend through openings formed through the generally closed bottom and the housing halves are juxtaposed and connected together with the drive roller of one housing half cooperating with the driven pinch roller of the other housing half. Located between the roller openings in the bottom of each housing half is a row of spaced-apart apertures through which a portion of a plurality of photo-optic transducing head assemblies project.

Abstract: A photo-optic transducer assembly comprising a frame constructed to surround the peripheral edges of a ceramic hybrid circuit card such that a radiation source and a radiation responsive element coupled to said hybrid circuit card are appropriately aligned with a photo-optic light pipe assembly, also supported by said frame, the light pipe element leading to a location where sensing is to occur. The hybrid circuit card contains active and passive components (including one or more integrated circuit chips) on it for processing signals indicative of conditions being irradiated by a source of radiant energy.