Patents Assigned to Henkel Loctite Adhesives Limited
  • Lead-free solder paste
    Patent number: 6592020
    Abstract: The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles less than 25 &mgr;m in size homogenously dispersed therein to provide improved solder alloy powder coalescence and substrate surface wetting while maintaining appropriate solder paste rheology for use in printed circuit board assembly processes.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: July 15, 2003
    Assignee: Henkel Loctite Adhesives Limited
    Inventors: Mark Currie, Angelo Elyassi, Grahame Freeman, Malcolm Warwick, Ian Wilding