Abstract: A simple method is provided for firmly-bonded connection of an electronic component to a substrate, which dispenses with the use of lead-containing paste solders and leads to a contact layer featuring sufficiently high resistance to heat fatigue in an environment characterized by incessant periodical temperature variations, and featuring high thermal and electrical conductivity.

Abstract: A sputtering target is provided which ensures the production of unvaryingly homogenous layers of the sputtering material during the lifespan of the sputtering target. The sputtering target includes a mixture of oxides of indium, zinc, and gallium, the mixture containing at least one ternary mixed oxide of indium, zinc, and gallium and at least one amorphous phase. The portion of ternary mixed oxides of indium, zinc, and gallium is at least 50 weight percent, relative to the total weight of the mixture, and the portion of amorphous phase is at least 20 weight percent, relative to the total weight of the mixture.

Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.

Abstract: A process is provided for fastening an electronic component to a substrate, the process including the steps of: (i) providing an electronic component and a substrate; (ii) creating a sandwich arrangement having the electronic component, the substrate and a layer arranged in between them, wherein the layer includes a paste containing (a) metal particles having a coating including at least one coating compound selected from the group consisting of fatty acids, fatty acid salts and fatty acid esters, and (b) at least one aliphatic hydrocarbon compound; and (iii) sintering the sandwich arrangement.

Abstract: Castings made of boron-containing alloys based on at least one platinum group metal are treated by thermal ageing in the presence of oxygen and at temperatures below the melting point of the alloy. This enables the alloys to be processed at temperatures customary in the jewelry industry. The treated castings can also be processed into medical technology products.