Abstract: The invention concerns a method for soldering of additional electronic components onto a circuit board having components which have already been soldered and mounted thereto, wherein the additional components are plugged through the circuit board and soldered thereto. In order to be able to subsequently solder the components in a simple and reliable fashion, a template, having a pattern of holes corresponding to the soldering points and locations which are to be subsequently formed on the circuit board, is lowered and pressed onto the surface of a solder bath in such a fashion that the solder displaces into the holes and rises up within same. The circuit board having the previously mounted additional components is placed onto the template in such a fashion that the regions which are to be soldered are disposed within the openings of the template and dipped into the solder located therein.