Patents Assigned to Hermes-Epitek Corporation
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Patent number: 8484847Abstract: A showerhead is disclosed in this invention. The showerhead includes a bottom portion, at least one plate, and a top portion. The bottom portion includes a plurality of gas tubes which are integratedly formed on the bottom portion. The gas tubes include at least one first gas tube. The at least one plate includes a first plate. The first plate includes a plurality of first openings, wherein the gas tubes pass through the first openings. The top portion is coupled to the bottom portion for forming at least one inner space.Type: GrantFiled: April 9, 2010Date of Patent: July 16, 2013Assignee: Hermes-Epitek CorporationInventors: Chien-Ping Huang, Tsan-Hua Huang
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Patent number: 8448288Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.Type: GrantFiled: March 17, 2010Date of Patent: May 28, 2013Assignee: Hermes-Epitek CorporationInventors: Chien-Ping Huang, Tsan-Hua Huang, Tsung-Hsun Han
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Publication number: 20120304922Abstract: Semiconductor equipment is disclosed in this invention. The semiconductor equipment includes a reaction chamber, a wafer susceptor, and a liner device. The reaction chamber includes an opening and a circular inner wall. The wafer susceptor is capable of carrying at least one wafer. The liner device is disposed between the wafer susceptor and the circular inner wall of the reaction chamber. The liner device is capable of moving vertically between a first position and a second position. The liner device includes at least one venting opening, wherein the venting opening is connected with a venting device. Particles which are accumulated within the liner device can be removed by the venting device.Type: ApplicationFiled: May 17, 2012Publication date: December 6, 2012Applicant: HERMES-EPITEK CORPORATIONInventors: Jui-Sheng CHENG, Tsung-Hsun HAN, Tsan-Hua Huang
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Patent number: 8216640Abstract: A method of making a showerhead for a semiconductor processing apparatus is disclosed. In one embodiment, the method includes providing a substrate; forming first holes in the substrate; forming a protective film on the substrate, where the protective film covers sidewalls of the first holes; and forming second holes in the substrate, where a part of the protective film within the first holes is removed. In another embodiment, the method includes providing a substrate; forming islands on the substrate; forming a protective film on the substrate, where the protective film does not cover the tops of the islands; and forming holes in the islands.Type: GrantFiled: September 25, 2009Date of Patent: July 10, 2012Assignee: Hermes-Epitek CorporationInventors: Ben-Son Chao, Yu-Feng Chang, Yen-Si Chen
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Publication number: 20120024478Abstract: A showerhead is disclosed in this invention. The showerhead includes a bottom plate, a channel plate, and a top plate. The bottom plate includes a plurality of cooling channels and a plurality of gas holes, wherein the gas holes includes at least one first gas hole and at least one second gas hole. The channel plate includes a first trench area and a second trench area, wherein the first gas hole is connected with the first trench area, and the second gas hole is connected with the second trench area. The top plate is coupled to the channel plate.Type: ApplicationFiled: July 29, 2010Publication date: February 2, 2012Applicant: HERMES-EPITEK CORPORATIONInventors: Chien-Ping Huang, Tsan-Hua HUANG
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Publication number: 20110186228Abstract: A showerhead is disclosed in this invention. The showerhead includes a bottom portion, at least one plate, and a top portion. The bottom portion includes a plurality of gas tubes which are integratedly formed on the bottom portion. The gas tubes include at least one first gas tube. The at least one plate includes a first plate. The first plate includes a plurality of first openings, wherein the gas tubes pass through the first openings. The top portion is coupled to the bottom portion for forming at least one inner space.Type: ApplicationFiled: April 9, 2010Publication date: August 4, 2011Applicant: HERMES-EPITEK CORPORATIONInventors: Chien-Ping Huang, Tsan-Hua Huang
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Publication number: 20110186078Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.Type: ApplicationFiled: March 17, 2010Publication date: August 4, 2011Applicant: HERMES-EPITEK CORPORATIONInventors: Chien-Ping HUANG, Tsan-Hua HUANG, Tsung-Hsun HAN
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Publication number: 20110186761Abstract: A gate valve includes a valve member and a valve plate. The valve member includes an opening. The valve plate is capable of sealing the opening, and is further capable of moving a proper distance and rotating a proper angle relative to the opening so as to open or seal the opening.Type: ApplicationFiled: March 17, 2010Publication date: August 4, 2011Applicant: HERMES-EPITEK CORPORATIONInventors: Chien-Ping HUANG, Tsung-Hsun HAN
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Publication number: 20110076401Abstract: A method of making a showerhead for a semiconductor processing apparatus is disclosed. In one embodiment, the method includes providing a substrate; forming first holes in the substrate; forming a protective film on the substrate, where the protective film covers sidewalls of the first holes; and forming second holes in the substrate, where a part of the protective film within the first holes is removed. In another embodiment, the method includes providing a substrate; forming islands on the substrate; forming a protective film on the substrate, where the protective film does not cover the tops of the islands; and forming holes in the islands.Type: ApplicationFiled: September 25, 2009Publication date: March 31, 2011Applicant: HERMES-EPITEK CORPORATIONInventors: BEN-SON CHAO, YU-FENG CHANG, YEN-SI CHEN