Abstract: In the present disclosure techniques related to display of device independent color differences are described. In examples, a color comparison graphical user interface (GUI) is operated. The GUI displays a color of a sample object. Further, the GUI displays a color of a reference object. Further, the GUI displays a device independent color difference between the sample color and the reference color.

Abstract: The present disclosure relates to color calibration chart acquisition. In an example, a video acquired by an imaging device may be processed. The video may be analyzed to automatically detect a reproduction of a color calibration chart. Upon detection of a reproduction of the color calibration chart, it may be determined whether color calibration chart reproduction quality is within a selected quality threshold. Upon determining that color calibration chart reproduction quality is not within a selected threshold, user feedback may be provided, via the imaging device, to dynamically guide the user to make adjustments in the video acquisition in order to obtain a color calibration chart reproduction within the selected quality threshold.

Abstract: Print system, having two substrate roll supports for mounting substrate rolls, a drive assembly arranged to rotate substrate rolls, and a transmission arranged to transmit a torque from the drive assembly to the substrate roll supports so that during use the torque acting on each substrate roll is approximately equal.

Abstract: A critical temperature warning apparatus and method to monitor the thermal history of a product such as a memory card. The apparatus comprises a critical temperature indicator, which is externally attached to a product to be monitored. The indicator indicates if the product has experienced a critical temperature. The critical temperature indicator may comprise a patterned array of wax, the wax having a melting point equal to the critical temperature. If the pattern of wax has been destroyed leaving a molten wax residue, then this indicates that the product has experienced a critical temperature. The critical temperature indicator may also include thermographic inks for indicating that a critical temperature has been experienced.

Abstract: A memory device includes memory cells having two tunnel junctions in series. In order to program a selected memory cell, a first tunnel junction in the selected memory cell is blown. Blowing the first tunnel junction creates a short across the first tunnel junction, and changes the resistance of the selected memory cell from a first state to a second state. The change in resistance is detectable by a read process. The second tunnel junction has different anti-fuse characteristic than the first tunnel junction, and is not shorted by the write process. The second tunnel junction can therefore provide an isolation function to the memory cell after the first tunnel junction is blown.

Abstract: A system for precision self-alignment of multiple modules on an alignment substrate is disclosed. An alignment substrate includes a plurality of self-alignment features having a first profile formed in along a mounting surface thereof. A plurality of module substrates are mounted on the alignment substrate. Each module substrate includes an alignment key having a second profile formed along a base surface of the module substrate. The second profile of the alignment key complements the first profile of the self-alignment features. The module substrates are mounted on the alignment substrate by inserting their respective alignment keys into the self-alignment features so the alignment keys and the self-alignment features are connected in mating engagement with each other. As a result, the module substrates are positioned in near perfect self-alignment with each other with substantially no skew.

Abstract: A level of a solid state memory device includes main memory and address logic. The address logic is programmed by causing current to flow through an address element of the logic; and irradiating the address element so that the address element changes resistance states.