Abstract: In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.
Type:
Grant
Filed:
January 23, 2017
Date of Patent:
March 10, 2020
Assignee:
Hewlett-Packard Development Compnay, L.P.
Inventors:
Arthur Lin, Chienchih Chiu, Ken Tsai, Chiacheng Wei
Abstract: A method, apparatus, and system for securing data on a removable memory device, which is removably coupled to and accessible by a computing apparatus, are disclosed. Upon an attempt by a user to access the removable memory device, a manual key is recovered by a manual key interface device. This manual key is used to authenticate the identity of the user. Upon the authentication where the user identity corresponds to authorized access to the memory device, the access is enabled. Upon the authentication, where the user identity does not correspond to authorized access to the memory device, the access is prohibited.
Type:
Grant
Filed:
August 30, 2005
Date of Patent:
May 10, 2011
Assignee:
Hewlett-Packard Development Compnay, L.P.
Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.
Type:
Grant
Filed:
January 27, 2005
Date of Patent:
May 11, 2010
Assignee:
Hewlett-Packard Development Compnay, L.P.
Inventors:
Simon Dodd, Sean P. McClelland, Colby Van Vooren, Terry E. McMahon, Antonio Cruz-Uribe
Abstract: A printed circuit board comprises a plurality of inner and outer holes. An electrically conductive barrel may be disposed in each outer hole, and an electrically conductive barrel and a probe may be disposed in each inner hole. The electrically conductive barrels may protrude from the bottom of the interface board at substantially similar fixed heights. Transfer paths may couple at least some of the barrels in the outer holes to selected barrels in the inner holes.
Type:
Grant
Filed:
January 7, 2004
Date of Patent:
August 29, 2006
Assignee:
Hewlett-Packard Development Compnay, L.P.
Inventors:
Kevin R. Dick, Walter J. Belmore, III, Rodney E. Thomsen, Robert R. Covington
Abstract: An aggregated data clustering method and system. First, the data points to be clustered and a size parameter are received. The size parameter specifies the number of data points to be moved at one time in the clustering algorithm. Next, the data points are clustered by using an aggregated clustering algorithm (e.g., aggregated local K-Means clustering algorithm) and the size parameter to generate clustered results. Then, a determination is made whether of not the clustered results are satisfactory. If the clustered results are satisfactory, the clustering is stopped. Otherwise, a modified or refined parameter size is received. Then, clustering is performed on the clustered results generated previously by using the aggregated clustering algorithm and the revised or refined parameter size. The steps of determining, modifying the parameter size, and aggregated clustering are repeated until satisfactory clustering results are achieved.
Type:
Grant
Filed:
October 4, 2000
Date of Patent:
September 13, 2005
Assignee:
Hewlett-Packard Development Compnay, L.P.
Assignee:
Hewlett-Packard Development Compnay, L.P.
Inventors:
Raymond Wayne Moskaluk, Jaime E. Dorman, Jodi Bay, Stephen Hall, Mark McCluskey, John Jamieson, Robert A. Horenstein, Jeffrey A. Tilley, Joseph Wong