Abstract: A resin formulation, especially adapted for use in the encapsulating of electronic or electric devices, is provided. The formulation comprises a thermosettable resin composition to which has been added an effective amount of a trialkoxyorgano-metal silane compound. The formulation also preferably includes a solid filler material.
Abstract: This invention provides, in a first aspect, means for obtaining a liquid thermosetting polyester resin composition which is degassed without the loss of volatile component, by the presence of a dimethyl polysiloxane ingredient in the resin composition. The second aspect of the invention provides for mold lubrication and parting without substantial surface problems in the finished product by the presence of a mixture of an alkyl phosphate ester parting agent in combination with an alkylene bis-alkamide material.
Abstract: This invention provides, in a first aspect, means for obtaining a liquid thermosetting polyester resin composition which is degassed without the loss of volatile component, by the presence of a dimethyl polysiloxane ingredient in the resin composition. The second aspect of the invention provides for mold lubrication and parting without substantial surface problems in the finished product by the presence of a mixture of an alkyl phosphate ester parting agent in combination with an alkylene bis-alkamide material.