Patents Assigned to High Speed Interconnects, LLC
  • Patent number: 11552432
    Abstract: A shield for a cable attachment system for attaching a cable to a component having a ball grid array (BGA). The shield may comprise an outer conductive surface, a first end configured to be coupled to a surface of the component, a second end that receives the cable, and an inner non-conductive material received within the shield adjacent the first end and encasing the connection of the cable to the BGA of the component. The cable may be configured to be coupled to the BGA of the component.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 10, 2023
    Assignee: High Speed Interconnects, LLC
    Inventors: Antonio De La Rosa, Todd Albertson
  • Patent number: 10939545
    Abstract: A foldable modular flex circuit for attaching to at least one component. The flex circuit may comprise a central area and at least one tab depending from the central area. The central area may comprise a cable attachment section configured to electrically couple to at least one coaxial cable. A first tab may depend from the central area and is configured to electrically couple to a ball grid array (BGA) of the component. A second pair of tabs may depend from the central area and are configured to electrically couple to an additional at least one component, wherein each tab depends substantially perpendicular from the central area.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: March 2, 2021
    Assignee: High Speed Interconnects, LLC
    Inventors: Antonio De La Rosa, Todd Albertson
  • Patent number: 10096953
    Abstract: Methods and apparatus for a shielded and grounded cable assembly include a coaxial cable assembly having a uniform spacing between cables to pre-align the cable assembly in an array corresponding to a connection layout of at a source end. The cable assembly includes a plurality of coaxial cables with exposed shields that are commonly grounded to a drain wire. The cable assembly may also be configured to be connected vertically/perpendicularly to a ball grid array or edge connected to a circuit board.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: October 9, 2018
    Assignee: High Speed Interconnects, LLC
    Inventors: Donovan Finnestad, James Alexander Moss, Antonio De La Rosa, Todd Albertson