Patents Assigned to Hightec MG AG
  • Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors
    Patent number: 5227012
    Abstract: In multi-layer thin film circuits, fabricated by alternate formation of conductor layers and insulating layers, there can be integrated thin film resistors which bear directly upon the substrate but nonetheless are not subjected, during manufacture, to the high temperatures of curing of the insulating layers and which then would be damaged. The manufacturing method also allows producing integrated electrical contacting between the thin film resistors and conductors of all of the conductor layers.
    Type: Grant
    Filed: April 15, 1991
    Date of Patent: July 13, 1993
    Assignee: Hightec MG AG
    Inventors: Gerold Brandli, Guido Bachmann