Patents Assigned to Hitachi Cable Precision Co., Ltd.
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Patent number: 7888697Abstract: A lead frame includes a base material, a reflection layer formed on a part of the base material, and a characteristic sustaining layer formed at least on the reflection layer to cover the reflection layer for sustaining a characteristic of the reflection layer by isolating the reflection layer from an outside. The reflection layer includes the characteristic to exhibit a predetermined reflectivity to light with a predetermined wavelength, and the characteristic sustaining layer prevents a decrease in the reflectivity of the reflection layer and transmits light reflected by the reflection layer.Type: GrantFiled: December 2, 2008Date of Patent: February 15, 2011Assignees: Hitachi Cable Precision Co., Ltd.Inventors: Tadashi Kawanobe, Yuichi Ohnuma, Mamoru Mita
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Patent number: 7808086Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.Type: GrantFiled: May 29, 2008Date of Patent: October 5, 2010Assignees: NEC Electronics Corporation, Hitachi Cable Precision Co., Ltd.Inventors: Akimi Saiki, Hiroyuki Shoji, Gousuke Takahashi, Noriyuki Hasegawa, Fumio Takano, Kouji Sato
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Patent number: 7795053Abstract: A method for producing a light-emitting device comprising: a step of electrically connecting a first electrode provided on one main surface of a semiconductor substrate (element substrate) through a light-emitting layer, and a first lead of a lead frame, so as to oppose each other; a step of electrically connecting a second electrode provided on the rear surface of a surface provided with the light-emitting layer of said element substrate, and a second lead of the above-described lead frame; a step of encapsulating a connecting part of said first electrode and said first lead, and said second electrode, and an electrode part of the second lead, with a transparent resin; and a step of producing a discrete edge by cutting said first lead and the second lead from said lead frame; wherein a film of joining material (joining material film) made of an alloy or a single metal, is formed on the first electrode of said light-emitting element, and a pattern to reduce spreading of said joining material is formed on an eType: GrantFiled: March 24, 2004Date of Patent: September 14, 2010Assignees: Hitachi Cable Precision Co., Ltd, Stanley Electric Co., Ltd.Inventors: Eiji Ohno, Syoichi Takahashi, Mikiyoshi Kawamura, Minoru Yamamura, Tadashi Tamaki, Hayato Oba, Masataka Kagiwada, Hiroyuki Takayama, Kei Teramura, Atsushi Ohtaka, Toshiaki Morikawa
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Patent number: 7476913Abstract: A light emitting device has a cup portion with a bottom surface opening, and one electrode of a light emitting element is connected to the cup portion. The other electrode of the light emitting element is connected to a lead set up from an inner space to outside the cup portion using the opening of the cup portion. Each electrode and lead of the light emitting device can be electrically connected without bonding wires. This prevents shadows or light unevenness from reflecting the shape of the bonding wire, thereby enhancing light-emission efficiency. As an alternative to setting up the lead from inside to the outside of the cup portion, the lead existing outside the cup portion and the other electrode are electrically connected via the bonding wire through the cup portion's opening. Thus, light outputted outside of the light emitting device is not intercepted by the bonding wire.Type: GrantFiled: August 10, 2004Date of Patent: January 13, 2009Assignees: Renesas Technology Corp., Hitachi Cable Precision Co., Ltd., Hitachi Cable, Ltd.Inventors: Hiroyuki Isobe, Gen Murakami, Toshikatsu Hiroe
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Publication number: 20080296746Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.Type: ApplicationFiled: May 29, 2008Publication date: December 4, 2008Applicants: NEC ELECTRONICS CORPORATION, HITACHI CABLE PRECISION CO., LTD.Inventors: Akimi SAIKI, Hiroyuki SHOJI, Gousuke TAKAHASHI, Noriyuki HASEGAWA, Fumio TAKANO, Kouji SATO