Patents Assigned to Hitachi Condenser Co., Ltd.
  • Process for producing printed wiring boards
    Patent number: 5153987
    Abstract: By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: October 13, 1992
    Assignees: Hitachi Chemical Company, Ltd., Hitachi, Condenser Co., Ltd., Yokohama Rubber Company Limited
    Inventors: Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshiro Okamura, Naoki Fukutomi, Hiroyoshi Yokoyama, Hideo Watanabe, Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi
  • Process for producing printed wiring board
    Patent number: 4790894
    Abstract: A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.
    Type: Grant
    Filed: May 6, 1987
    Date of Patent: December 13, 1988
    Assignee: Hitachi Condenser Co., Ltd.
    Inventors: Masaji Homma, Hitoshi Yamauchi
  • Process for producing printed circuit board
    Patent number: 4585502
    Abstract: A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.
    Type: Grant
    Filed: February 14, 1985
    Date of Patent: April 29, 1986
    Assignee: Hitachi Condenser Co., Ltd.
    Inventors: Nobuo Uozu, Hiroyoshi Yokoyama, Yoichi Matsuda