Abstract: A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side in the conveying direction of the epoxy resin composition, the method comprising kneading the epoxy resin composition, while discharging a volatile gas from the kneader through the suction hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice. Even under conditions of continuous operation of the kneader, it is possible to efficiently discharge a volatile gas, thereby significantly decreasing the quantity of a volatile components remaining in the kneaded epoxy resin composition.

Abstract: A permanent resist obtained by at least photoexposure and alkali development of a photosensitive resin composition, the permanent resist containing a metal carboxylate group, or a carboxyl group (a carboxyl anhydride group is also included among a carboxyl group according to the invention) and a metal carboxylate group, wherein an alkaline earth metal carboxylate group constitutes at least 30 mole percent of the total of a carboxyl group and a metal carboxylate group.