Patents Assigned to Hitachi Micro Eng. Ltd.
  • Patent number: 4739444
    Abstract: In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.
    Type: Grant
    Filed: March 3, 1986
    Date of Patent: April 19, 1988
    Assignees: Hitachi, Ltd., Hitachi Micro Eng. Ltd.
    Inventors: Shizuo Zushi, Tetsuo Ogata, Mitsuo Miyamoto, Tsutomu Imai, Fumiyuki Kobayashi