Patents Assigned to Hongsheng Technology (Beijing) Co., Ltd
  • Patent number: 11834589
    Abstract: The present disclosure relates to a modified environment-friendly corn starch adhesive, comprising the following components in parts by weight: 30 parts of corn starch, 300-400 parts of water, 0.2-3 parts of oxidant, and 80-120 parts of polyvinyl alcohol, 1-5 parts of cross-linking agent, 3-5 parts of calcium chloride, 0.1-3 parts of urea, 0.2-0.5 parts of defoamer, and an appropriate amount of sodium hydroxide (to adjust pH), the cross-linking agent is a modified boric acid cross-linking agent prepared by reacting boric acid with epichlorohydrin, water and citric acid at 80-100° C. The surface of the modified boric acid cross-linking agent is bonded with a large number of epoxy groups and carboxyl groups, which can react with the carboxyl and aldehyde groups of the oxidized starch. These reactions can form synergistic effect with boric acid, which together improve the bonding efficiency and improve the adhesive strength of the colloid.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: December 5, 2023
    Assignee: HONGSHENG TECHNOLOGY (BEIJING) CO., LTD
    Inventors: Zhongda Duan, Runda Yan
  • Patent number: 11603483
    Abstract: The invention belongs to the technical field of binders, and particularly relates to an environment-friendly anti-oxidation carton adhesive and a preparation method thereof. The adhesive comprises the following components: dry starch, p-aminophenol epoxy resin, hydrogen peroxide, borax, sodium dicyandiamide, dimethyl carbonate, phthalic anhydride polyester polyol, polyethylene terephthalate, triethanolamine and antioxidant. The anti-oxidant is a compound of hindered phenol, phosphite ester, and a metal ion chelating agent. The adhesive not only has high bonding strength, but also has the effects of non-discoloring, mildewing and the like when used for a long time.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: March 14, 2023
    Assignee: Hongsheng Technology (Beijing) Co., Ltd
    Inventors: Zhongda Duan, Jiafei Yan