Abstract: A heat source unit for concentrating radiant rays from a heat source lamp onto the processing site of the material to be processed by, for example, soldering, so as to bring this site to a requisite high temperature, comprises a mirror assembly composed of a pair of symmetrical half bodies, which have each an arcuate reflecting surface and together form a concave mirror. A pair of reflective side plates are mounted detachably on the opposite sides of the mirror assembly. The mirror assembly has cooling channels permitting circulation of cooling water therethrough. A heat resistant and light-transmissive shield plate is disposed over an irradiation opening of the unit and is supported by and between a pair of adjustable masking elements at opposite ends of the mirror assembly thereby defining a heat outlet opening of adjustable width. Housing shells are fixed detachably on each of the side plates. Pipe connections are provided for connecting the cooling channels and for feeding and discharging cooling water.

Abstract: An apparatus for the automatic soldering of lead pins distributed on a packaged IC chip in bilateral or quadrilateral parallel rows, to corresponding contact pins which are distributed on a substrate printed circuit board in rows corresponding to said rows of lead pins and have preliminarily been pasted with solder. The packaged IC chip is placed on the substrate board, and the packaged IC chip is positioned to align each lead pin in the rows on the packaged IC chip with a corresponding contact pin in the rows on the substrate board. The lead pin together with the contact pin aligned therewith is then exposed to iradiation by a heat ray emitted from a heat ray soldering head and focussed thereon as a line of focus in the form of a segment of a line corresponding to the soldering line.

Abstract: An apparatus for the continuous processing of a work piece, such as an IC-chip or an LSI-chip, in the directions of the x- and y-coordinates, which comprises a pair of heat ray sources arranged on a heat ray source assembly for irradiating a corresponding pair of parallel processing lines extending in the direction of the x-coordinate, by focussing heat rays onto each of the processing lines in the shape of a straight line. A cylinder/piston arrangement effects vertical positioning of the pair of heat ray sources for adjusting the focussing of heat rays onto the processing line. A turning mechanism turns the heat ray source assembly through 90.degree. so as to align the pair of line foci with a pair of parallel processing lines extending in the direction of the y-coordinate. There is a distance adjustment for adjusting the distance between the pair of parallel line foci by effecting a parallel relative shifting of the pair of heat ray sources.

Abstract: Soldering apparatus for effecting, for example, a firm connection of the lead pins on IC-packages to a printed circuit board bearing corresponding lead lines. The workpiece such as an IC-package is placed at a predetermined position on the printed circuit board such that the lead pins on the IC-package and the corresponding lead lines on the circuit board, on which the solder has been applied, are in contact with each other. These sites of contact are subjected to radiant heating to cause soldering of them, by the use of apparatus which comprises a mounting base provided with a pair of diagonally disposed arms together with, if necessary, another pair of arms disposed also diagonally but rectangularly to the first pair of arms. Heat sources such as lamp units produce the radiant heat rays and focus them onto the sites of contact of the lead pins with the lead lines to be soldered.