Patents Assigned to Hybird Electronics Australia Pty Ltd.
  • Circuits including a titanium substrate
    Patent number: 7632537
    Abstract: A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titanium or titanium-alloy substrate is also disclosed.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: December 15, 2009
    Assignee: Hybird Electronics Australia Pty Ltd.
    Inventor: Walter Henry Berryman