Abstract: A method for fabricating a semiconductor device includes providing a substrate including first landing plugs and second landing plugs that are arrayed on a first line, forming a capping layer over the substrate, forming hole-type first trenches that expose the second landing plugs by selectively etching the capping layer, forming an insulation layer over the substrate including the first trenches, forming line-type second trenches that are stretched on the first line while overlapping with the first trenches by selectively etching the insulation layer, and forming a first conductive layer inside the second trenches.

Abstract: A semiconductor device includes a plurality of cell blocks activated in response to a plurality of selection signals, respectively, a pre-selection signal generator configured to generate a plurality of pre-selection signals corresponding to the cell blocks, respectively, and activate at least two of the pre-selection signals by decoding addresses in a multi-test mode, a selection signal controller configured to selectively activate the plurality of selection signals in response to the plurality pre-selection signals and control active periods of the activated selection signals so as not to overlap, and a decision circuit configured to decide whether or not the cell blocks activated in response to the activated selection signals are repaired in response to stored repair information and the plurality of selection signals.

Abstract: An integrated circuit chip includes an internal circuit configured to generate output data, an inversion determination unit configured to activate/deactivate an inversion signal according to state information regarding a state of the integrate circuit chip, and a signal output circuit configured to invert or not to invert the output data in response to the inversion signal and output the inverted or non-inverted output data.

Abstract: An isolation layer of a semiconductor device and a process for forming the same is described herein. The isolation layer includes a trench that is defined and formed in a semiconductor substrate. A first liner nitride layer is formed on the surface of the trench and a flowable insulation layer is formed in the trench including the first liner nitride layer. The flowable insulation layer is formed such to define a recess in the trench. A second liner nitride layer is formed on the recess including the flowable insulation layer and the first liner nitride layer. Finally, an insulation layer is formed in the recess on the second liner nitride layer to completely fill the trench.

Abstract: An integrated circuit includes an input pad configured to receive a low-speed signal and a high-speed signal, a high-speed buffer coupled to the input pad, a low-speed buffer coupled to the input pad, a strobe input unit configured to receive a strobe signal for indicating an input of the high-speed signal to the input pad, and a buffer control unit configured to control an activation of the high-speed buffer in response to the strobe signal.

Abstract: A method for fabricating a semiconductor device includes forming an etch-target layer over a substrate having a first region and a second region, stacking first and second hard mask layers over the etch-target layer, forming spacer patterns over the second hard mask layer of the first area, etching the second hard mask layer using the spacer patterns as an etch barrier, forming a hard mask pattern over the first hard mask layer of the second region, etching the first hard mask layer using the second hard mask layer of the first region and the hard mask pattern of the second region as etch barriers, removing the hard mask pattern of the second region, and etching the etch-target layer using the first and second hard mask layers of the first region and the first hard mask layer of the second region as etch barriers.

Abstract: An internal voltage compensation circuit is provided which includes a power up signal generator configured to generate a power up signal, a select signal generator configured to compare a level of a first external voltage with a level of a second external voltage to generate first and second select signals, wherein the second select signal is generated in response to the power up signal, and a voltage compensation unit configured to electrically connect an internal voltage to the first external voltage or the second external voltage in response to the first and second select signals.

Abstract: A bit line equalizing signal generator of a semiconductor memory device uses a supply voltage and a pumping voltage in stages during a period where a bit line equalizing signal is enabled, thereby enhancing an equalizing speed and an active speed while minimizing power consumption. The semiconductor memory device includes a bit line equalizing signal generating unit configured to drive an output terminal with the supply voltage during a first activation period at the beginning of the period where the bit line equalizing signal is enabled, and to drive the output terminal with the pumping voltage higher than the supply voltage during a second activation period following the first activation period, thereby outputting the bit line equalizing signal, and a bit line equalizing unit configured to equalize a bit line pair in response to the bit line equalizing signal.

Abstract: An internal voltage generating circuit capable of controlling a swing width of a detection signal in a semiconductor memory apparatus is provided. The internal voltage generating circuit of a semiconductor memory apparatus includes an internal voltage level detecting unit configured to compare an internal voltage with a target voltage and then generate a detection signal, and an internal voltage level control unit configured to control the internal voltage based on a voltage level of the detection signal, wherein the internal voltage level detecting unit is configured to control a swing width of the detection signal based on a voltage difference between the internal voltage and the target voltage.

Abstract: A semiconductor device and a method for manufacturing the same are disclosed. When forming a profile of the lower electrode, a second lower electrode hole (i.e., a bunker region) located at the lowermost part of the lower electrode is buried with an Ultra Low Temperature Oxide (ULTO) material without damaging the lower electrode material. As a result, when a dielectric film is deposited in a subsequent process, the above-mentioned semiconductor device prevents the occurrence of a capacitor leakage current caused by defective gapfilling of the dielectric film located at the lowermost part of the lower electrode.

Abstract: An image processing system includes a pixel array including a plurality of regular pixel columns and at least one test pixel column, a plurality of column analog-to-digital converters (ADCs) configured to correspond to the regular pixel columns and convert analog input signals into digital signals, and a switching block configured to provide output signals of the regular pixel columns to input ends of the corresponding column ADCs in a normal mode, and provide in common an output signal of the test pixel column to the input ends of the column ADCs in a test mode, wherein the test pixel column generates signals having a minute voltage different from one row to another row.

Abstract: A semiconductor device having a buried gate is provided. The semiconductor device is formed in a structure in which a plurality of contacts having small step differences are stacked without forming a metal contact applying an operation voltage to the buried gate in a single contact and a contact pad is formed between the contacts so that failure due to misalignment can be prevented without a separate additional process for forming the contacts.

Abstract: A nonvolatile memory device includes a first storage unit configured to store a plurality of first fault address information provided in a first test operation, a second storage unit configured to store a plurality of second fault address information provided in a second test operation which is performed later than the first test operation; a redundancy operation unit configured to, in performing a redundancy operation, determine the number of operation circuits corresponding to the first fault address information and the number of operation circuits corresponding to the second fault address information among a plurality of redundancy operation circuits based on address number information; and an address providing unit configured to read the plurality of first fault address information and the plurality of second fault address information, and sequentially provide the read information to the redundancy operation unit, wherein the address providing unit is further configured to detect the number of the first f

Abstract: There is provided a command generation circuit. The command generation circuit includes a first driving unit driving an output node in response to an internal MRS command and a RAS idle signal; a second driving unit driving the output node in response to an off-signal; and a latch unit latching a signal at the output node in response to a power-up signal and generating an SRR command.

Abstract: A semiconductor memory device and method for operating the same includes a controller configured to generate a data buffer control signal in a mode register set (MRS) mode, a data buffer configured to buffer and output a plurality of MRS codes inputted through a data pad in response to the data buffer control signal, and a plurality of MRS command generators configured to receive the MRS codes outputted from the data buffer through a data line and generate a plurality of MRS commands based on the received MRS codes.

Abstract: A semiconductor memory device includes an internal signal generation unit configured to output a column select signal and a write enable signal in response to an external address, a write circuit unit configured to output internal data corresponding to external data in response to the write enable signal, a core unit configured to store the internal data in response to the column select signal, and an output timing control unit configured to control output timings of the internal signal generation unit and the write circuit unit in response to an external command, an internal synchronization signal, and preamble related information.

Abstract: A semiconductor device including a cell region and a peripheral region, the semiconductor device comprising: a guard ring region provided between the cell region and the peripheral region, the guard ring region having a barrier structure.

Abstract: A semiconductor device includes a semiconductor substrate having an active region defined by a device isolation structure. A recessed channel is formed on the semiconductor substrate under the active region. A recessed junction region is formed between the recessed channel and the device isolation structure adjacent to the recessed channel.

Abstract: A nonvolatile memory device includes: N (N is an integer equal to or greater than 2) number of nonvolatile memory cells disposed in a flag area of a page, N number of flag page buffers configured to input and output flag data to and from the nonvolatile memory cells of the flag area, and a data input/output control unit configured to select R number of flag page buffers so that the flag data is inputted and outputted from the R selected flag page buffers and no flag data is inputted and outputted through unselected N-R number of flag page buffers, wherein no one flag page buffer of the R selected flag page buffers is immediately adjacent to another one of the R selected flag page buffers.

Abstract: To increase the integration degree of a semiconductor device, the semiconductor device having a Plasma-Induced Damage (PID) protective diode includes a well, at least a first transistor region formed over the well, a gate electrode formed over the first transistor region, a well guard disposed to include an open region while surrounding the first transistor region, a diode disposed in the open region, and a metal line configured to electrically connect the gate electrode and the diode. A space between transistor regions may be efficiently reduced, thus increasing the integration degree of a semiconductor device.