Patents Assigned to I-Chiun Precision Industry Co., Ltd.
  • Patent number: 9533423
    Abstract: A vibrating razor includes a handle, a razor blade and a flat-type vibration motor. The handle includes a front end having a receiving slot provided thereon; wherein the receiving slot includes a bottom wall. The razor blade is arranged at the front end of the handle. The flat-type vibration motor is arranged within the receiving slot and includes an outer shell with a cover; wherein the cover includes an external protruding dot on one side of an outer surface thereof. The flat-type vibration motor contacts the bottom wall of the receiving slot via the external protruding dot. Therefore, the external protruding dot can be utilized to increase the vibration strength of the razor blade as the flat-type vibration motor rotates to impact the bottom wall of the receiving slot.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: January 3, 2017
    Assignee: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventor: Wan-Shun Chou
  • Publication number: 20150323141
    Abstract: An optical component includes a light-emitting surface and a bottom surface opposite to the light-emitting surface. The light-emitting surface and the bottom surface cooperatively form a negative lens portion, two first positive lens portions, and two second positive lens portions. The first positive lens portions and the second positive lens portions surround the negative lens portion and arranged in a stagger manner. The first positive lens portion have a first curvature, the second position lens portion have a second curvature smaller larger than the first curvature.
    Type: Application
    Filed: May 7, 2014
    Publication date: November 12, 2015
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventors: Wan-Shun CHOU, Ming-Xian LIN
  • Publication number: 20150176800
    Abstract: A supporting base for a semiconductor chip comprises a substrate, a surrounding wall and a reflection plate. The surrounding wall is formed on the substrate, and an accommodating space is formed between the surrounding wall and the substrate and is provided for receiving the semiconductor chip therein. The semiconductor chip is electrically connected to the substrate. The surrounding wall includes a cut-out portion on one side thereof. The reflection plate is extend to be bent from the substrate, and the reflection plate is configured to correspond to the cut-out portion and the semiconductor and is formed of an obtuse angle with the substrate. Therefore, with such structure, the present invention is able to achieve the effect of an increased illumination range.
    Type: Application
    Filed: December 25, 2013
    Publication date: June 25, 2015
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventors: CHIEN-YU CHEN, CHING-AN WU
  • Publication number: 20150129295
    Abstract: A double-shot injection molding formed LED lead frame structure includes an inner base having an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner bottom portion having an inner surface facing toward the central hollow portion; a plurality of conductive pins with each one thereof constructed by a soldering section, a securement section and an extension section respectively; and an outer base comprising an outer bottom portion attached to a bottom of the inner bottom portion and an outer surrounding wall surrounding on top of the outer bottom portion and enclosing an outer of the inner surrounding wall; wherein each one of the securement sections of the conductive pins extends to arch between the inner bottom portion and the inner surrounding wall.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventors: Ting-Hsi LI, Yu-Jen LIN
  • Publication number: 20140259676
    Abstract: A vibrating razor includes a handle, a razor blade and a flat-type vibration motor. The handle includes a front end having a receiving slot provided thereon; wherein the receiving slot includes a bottom wall. The razor blade is arranged at the front end of the handle. The flat-type vibration motor is arranged within the receiving slot and includes an outer shell with a cover; wherein the cover includes an external protruding dot on one side of an outer surface thereof. The flat-type vibration motor contacts the bottom wall of the receiving slot via the external protruding dot. Therefore, the external protruding dot can be utilized to increase the vibration strength of the razor blade as the flat-type vibration motor rotates to impact the bottom wall of the receiving slot.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventor: Wan-Shun CHOU
  • Publication number: 20140075751
    Abstract: The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas.
    Type: Application
    Filed: January 2, 2013
    Publication date: March 20, 2014
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventors: Ting-Hsi LI, Yu-Jen LIN
  • Patent number: 8192058
    Abstract: An LED recessed light with transparent board includes a heat sink base, an LED illumination module, a sleeve, a transparent board and a positioning element. The heat sink base has a first surface and a second surface. The LED illumination module is mounted on the first surface of the heat sink base thereof. The sleeve is mounted on the first surface of the heat sink, so as to the LED illumination module is located within the sleeve, and the sleeve is formed with an open end, which has an internal flange. The transparent board is arranged at internal flange of the sleeve for covering the sleeve. And the positioning element is mounted at the sleeve for positioning the transparent board.
    Type: Grant
    Filed: February 11, 2010
    Date of Patent: June 5, 2012
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventors: Meng Hsieh Chou, Yen Chi Wu
  • Patent number: 8079139
    Abstract: A method for producing an electro-thermal separation type light emitting diode support structure is provided. One of the embodiments for the support structure has at least two heat dissipation bases and at least two conductive supports which are coupled by a heat dissipation plate and a support plate. Another embodiment for the support structure has at least two heat dissipation bases and at least two conductive supports which are formed by a thick-thin plate. The light emitting diode chips of different types can be configured on the heat dissipation bases of these designs, respectively. Therefore, the invention achieves the goal of using different types of light emitting diode chips at the same time.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: December 20, 2011
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventors: Shih Chieh Lin, Li Min Chen, Yung Chieh Chen
  • Patent number: 7661842
    Abstract: A structure of a supporting assembly for a surface mount device LED and a manufacturing method thereof are provided. The structure of a supporting assembly comprises a plate and a substrate of LEDs. The plate has a plurality of supporting areas and a plurality of lenses each of which is respectively disposed on each supporting area. The substrate of LEDs comprises a metallic plate unit and a plurality of a surface mount device LED units each formed on the metallic plate unit. Moreover, the plate is combined with the metallic plate unit, so that each lens is respectively assembled with the corresponding surface mounting device LED unit. Via the above-mentioned structure, mass produced lenses can be assembled with and positioned on the corresponding LED units at the same time. The processes are modified and the production rate is increased.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: February 16, 2010
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventor: Wan-Shun Chou
  • Publication number: 20090027884
    Abstract: A structure of a supporting assembly for a surface mount device LED and a manufacturing method thereof are provided. The structure of a supporting assembly comprises a plate and a substrate of LEDs. The plate has a plurality of supporting areas and a plurality of lenses each of which is respectively disposed on each supporting area. The substrate of LEDs comprises a metallic plate unit and a plurality of a surface mount device LED units each formed on the metallic plate unit. Moreover, the plate is combined with the metallic plate unit, so that each lens is respectively assembled with the corresponding surface mounting device LED unit. Via the above-mentioned structure, mass produced lenses can be assembled with and positioned on the corresponding LED units at the same time. The processes are modified and the production rate is increased.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 29, 2009
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventor: WAN-SHUN CHOU
  • Publication number: 20090008755
    Abstract: A structure of an SMD (surface mount device) diode frame is provided that comprises a plastic seat and a plurality of metal pins. One side of the plastic seat has a concave functional area and the other side of the plastic seat corresponding to the functional area has a plurality of concave reserved holes. The functional area and the reserved holes are respectively formed via a forming bolt and a positioning bolt in a mold. If the forming bolt and the positioning bolt abut against the metal pins respectively, the preciseness of the size of the functional area is increased and the overflow of the material of the plastic seat is decreased. Furthermore, the yield of the manufacturing processes is improved.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventor: WAN-SHUN CHOU
  • Patent number: D627500
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: November 16, 2010
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventor: You Chuen Lain
  • Patent number: D627501
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: November 16, 2010
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventors: Hung Jie Lin, Yu Hsin Tsai, Meng Hsieh Chou
  • Patent number: D662235
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: June 19, 2012
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventors: You Cheun Lain, Meng Hsien Chou, Chun Ping Hsu
  • Patent number: D694202
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: November 26, 2013
    Assignee: I-Chiun Precision Industry Co., Ltd.
    Inventors: Shih-Chieh Lin, Shao-Cheng Tseng