Abstract: A high performance method and apparatus for testing a closed loop transducer is disclosed. A test bitstream signal is combined with a .SIGMA..DELTA. feedback bitstream of the transducer to produce a combined bitstream which is converted to a physical feedback to the sensor of the transducer. The .SIGMA..DELTA. bitstream output of the transducer is recorded for later analysis so as to test characteristics of the transducer. The test bitstream signal is preferably an oversampled, pulse density modulated signal. A testing arrangement is provided which is based upon the storage of short-length test patterns which are repetitively accessed to form a continuous test pattern. The test bitstream provided by the method of the invention produces very low noise and low distortion test signals where a repetitive test pattern is equivalent in length to one period of the test signal.

Abstract: A highly sensitive silicon micro-machined sensor package is provided for use in a micro-g environment that can also resist high shock in excess of 5000 g. The sensor is provided to measure acceleration in cooperation with associated electronics which are required to have electrical contact with sensor elements. The sensor is sealed in a high vacuum environment, and is arranged and designed to be free of temperature induced stress to the sensor. The sensor die package assembly comprises a silicon micro-machined sensor die, a ceramic package, two contact springs, a shorting clip, solder preform, a metal lid and a getter foil for ensuring a good vacuum for an extended period. The sensor die comprises a moving mass with eight supporting flexures on both sides of the proof mass. The proof mass's movement is protected on both sides by a top and a bottom cap. Acceleration applied to the package and the die causes the proof mass to move vertically in relation with the adjacent caps.

Abstract: A high performance method and apparatus for testing a closed loop transducer is disclosed. A test bitstream signal is combined with a .SIGMA..DELTA. feedback bitstream of the transducer to produce a combined bitstream which is converted to a physical feedback to the sensor of the transducer. The .SIGMA..DELTA. bitstream output of the transducer is recorded for later analysis so as to test characteristics of the transducer. The test bitstream signal is preferably an oversampled, pulse density modulated signal. A testing arrangement is provided which is based upon the storage of short-length test patterns which are repetitively accessed to form a continuous test pattern. The test bitstream provided by the method of the invention produces very low noise and low distortion test signals where a repetitive test pattern is equivalent in length to one period of the test signal.

Abstract: Apparatus for measuring a characteristic of motion and methods for its manufacture are disclosed in which a sensor structure includes a support structure, and a mass suspended from such support structure by a spring connecting arrangement and electrical devices for measuring displacement of the mass which results from a force applied to the support structure. An apparatus is provided where the mechanical spring constant of the connecting arrangement of the sensor structure is provided to be a high value representative of a strong, stiff spring which resists breaking due to high forces applied to it, and where an electric spring constant is provided to yield a small effective sensor spring constant K.sub.eff =K.sub.m -K.sub.e. Methods are also provided to manufacturing the apparatus by specifying the mechanical spring constant and providing an electric spring constant which will yield a desired effective spring constant which produces a desired characteristic of the sensor structure.

Abstract: A sensor structure (10) has a central mass (16) mounted within a support structure comprising an outer frame (18) with upper and lower covers (12, 14). Eight L-shaped or elbow-shaped ribbon springs are fit about the corners (28) of the mass (16) to allow mass (16) for movement from a reference position with respect to the support structure. One leg of each spring is connected to the middle of an associated side (26A) of the mass (16) while the other leg is connected to the outer frame (18). According to an alternative embodiment, each of the springs (72) is characterized by a relatively larger width at spring-mass connection point (74) and at spring-support connection point (73) and a relatively smaller width at an elbow-bend region between connection points.

Abstract: A sensor structure (10) has a central mass (16) mounted within a support structure comprising an outer support frame (18), and upper and lower plates or covers (12, 14). Eight L-shaped ribbon springs (32, 34) fit about the corners (28) of the mass (16) to mount mass (16) for movement from a reference position with respect to the support structure. One leg (38) of each spring (32, 34) is connected to an associated side (26A) of the mass (16) centrally of the length of the associated side (26A). The other leg (40) is connected to the outer support frame (18). The sensor structure is designed for use as a sensing mechanism in an electrostatic accelerometer arrangement.

Abstract: A method for fabricating a connecting spring member (24) of an arbitrary shape extending between a central mass (21) and an outer support frame (23) of a sensor as shown in FIG. 7 is disclosed. Each of a pair of generally identical silicon wafers (10, 12) has an inner etch stop layer (16) applied to one face with an outer epitaxial layer (18) formed over such etch stop layer (16). A photosensitive oxide layer (30) is applied to the other face of each of the wafers (10, 12). Next, a pattern of the central mass (21) and outer support frame (23) as shown in FIG. 2 is photographically imposed on the photosensitive oxide layers (18) of each wafer (10, 12). After wet chemical etching of the wafers (10, 12) removes silicon material to the etch stop layer, and the etch stop layer is itself removed in the space between the mass and the frame, the two wafers (10, 12) are bonded to each other as shown in FIG. 5 .