Abstract: A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on and covering the first conductor layer, a wiring layer formed in the interlayer insulating layer and including wirings, a second conductor layer formed on the interlayer insulating layer and including wirings, and a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first and second conductor layers. The interlayer insulating layer includes first and second insulating layers such that the wiring layer is formed on a surface of the first insulating layer, and the wiring layer is formed such that an aspect ratio of the wirings in the wiring layer is in the range of 2.0 to 6.0 and that aspect ratios of the wirings in the first and second conductor layers are in the range of 1.0 to 2.0.

Abstract: A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on the first conductor layer and covering the first conductor layer, a second conductor layer formed on the interlayer insulating layer and including wirings, a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first conductor layer and the second conductor layer, and a wiring part formed in the interlayer insulating layer and including an embedded wiring layer filling one or more grooves formed in the interlayer insulating layer. The interlayer insulating layer includes a first insulating layer and a second insulating layer laminated on the first insulating layer, and the embedded wiring layer is formed in the first insulating layer on a side facing the second insulating layer and filling the groove or grooves formed in the first insulating layer.

Abstract: A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.

Abstract: The present disclosure provides a plate-shaped heat insulator less susceptible to damage caused by thermal shrinkage. Provided is a plate-shaped heat insulator including an aggregate of multiple heat insulating members containing inorganic fibers, wherein the plate-shaped heat insulator is intended to be disposed in a combustion chamber.

Abstract: An object of the present invention is to provide a plate-shaped heat insulator with good workability during construction and less susceptible to damage after construction. Provided is a plate-shaped heat insulator including a plate-shaped papermaking product containing inorganic fibers, wherein the plate-shaped heat insulator is intended to be disposed in a combustion chamber.

Abstract: A wiring substrate includes a first insulating layer, a conductor layer including first and second conductor pads, a second insulating layer having an opening exposing the second conductor pads, and a wiring structure including a resin insulating layer and a wiring layer and formed in the opening of the second insulating layer. The wiring structure has first surface side connection pads, second surface side connection pads and electrically connected to the second conductor pads of the conductor layer, and conductors that electrically connect the first surface side connection pads and the second surface side connection pads, the first surface side connection pads form a component mounting surface having first and second component mounting region, and the first surface side connection pads include a group of pads in the first region and a group of pads in the second region electrically connected to the group of pads in the first region.

Abstract: A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generating, based on analysis of the conductor layer, classification of the circuits, inputting, to the machine, shot numbers for forming the openings determined based on the classification, and executing the machine based on the positions and shot numbers such that the openings are formed. The circuits include power supply, ground, and signal circuits, the classification includes stratifying such that the power supply and ground circuits belong to the first category and the signal circuits belong to the second category, and the inputting includes setting the shot number for the openings belonging to the first category is smaller than the shot number for the openings belonging to the second category.

Abstract: A wiring substrate includes a first insulating layer, a conductor layer including first and second pads, a second insulating layer having first openings exposing the first pads and a second opening exposing the second pads, metal posts formed on the first pads and filling the first openings, and a wiring structure positioned in the second opening and having first and second connection pads such that the second connection pads are connected to the second pads. The upper surfaces of the first connection pads and the upper surfaces of the metal posts form a component mounting surface having first, second and third regions, the first connection pads are formed in the first, second and third regions and include a group of first connection pads formed in the first and second regions and electrically connected and a group of first connection pads formed in the first and third regions and electrically connected.

Abstract: Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). The first inorganic fibers (30) are amorphous fibers. The second inorganic fibers (31) contain at least one kind selected from amorphous fibers having a glass transition point higher than that of the first inorganic fibers (30) and crystalline fibers.

Abstract: Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). An average fiber diameter of the first inorganic fibers (30) is larger than an average fiber diameter of the second inorganic fibers (31). The first inorganic fibers (30) have a linear shape or a needle shape, and the second inorganic fibers (31) have a dendritic shape or a crimped shape.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer such that the conductor layer includes a conductor pad, and a solder resist layer formed on the surface of the insulating layer such that the solder resist layer is covering the conductor layer and having an opening exposing the conductor pad. The conductor pad of the conductor layer has a substantially rectangular planar shape such that the conductor pads has a main surface, a pair of long sides, a pair of short sides and four corner portions, and the solder resist layer is formed such that the opening is exposing side surfaces at the long sides and 50% or more of the main surface and that the solder resist layer is covering side surfaces at the short sides.

Abstract: A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.

Abstract: A printed wiring board includes a first insulating layer, a conductor layer on the first insulating layer, and a second insulating layer formed on the first insulating layer and covering the conductor layer. The conductor layer includes first, second and third circuits, the first circuit has first width of 15 ?m or less, the first and second circuits have second space between the first and second circuits such that the second space has second width of 14 ?m or less, the first and third circuits have third space between the first and third circuits such that the third space has third width of 20 ?m or more, and the first circuit has first lower and upper surfaces, and second and third side walls such that second angle between the second wall and the first lower surface is larger than third angle between the third wall and the first lower surface.

Abstract: The present invention relates to a honeycomb catalytic converter, including: a honeycomb structured body in which multiple through-holes are arranged longitudinally in parallel with one another with a partition wall therebetween; and Pd and Rh supported on the partition walls of the honeycomb structured body, wherein the honeycomb structured body is an extrudate containing a ceria-zirconia complex oxide and alumina, a Pd-carrying region where only Pd is supported is formed on the partition walls within a predetermined width from one end of the honeycomb structured body, and a Rh-carrying region where only Rh is supported is formed on the partition walls within a predetermined width from the other end of the honeycomb structured body, and the Pd-carrying region extends to at least 50% of the length of the honeycomb structured body, and the Rh-carrying region extends to at least 20% of the length of the honeycomb structured body.

Abstract: A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor, and a coating film. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is formed in contact with the connection conductor and that the wiring pattern is covered by the coating film, the conductor pad has a surface facing the second insulating layer and having first surface roughness higher than surface roughness of a surface of the wiring pattern, and the coating film has opening exposing a portion of the surface of the conductor pad from the coating film and having area larger than area of interface between the conductor pad and the connection conductor and that the connection conductor is formed on the portion of the surface of the conductor pad and is separated from the coating film.

Abstract: The present invention aims to provide a sound-absorbing material having sound absorption performance with an average sound absorption coefficient of 0.65 or more in the frequency domain of 800 to 2000 Hz. The present invention relates to a sound-absorbing material including: a fiber layer including a plurality of holes open to a surface thereof and having a thickness of 3 mm or more; and an inorganic material layer formed on the surface of the fiber layer, the holes being blind holes each penetrating through the inorganic material layer and having a bottom inside the fiber layer.

Abstract: A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.

Abstract: A printed wiring board includes a first resin insulating layer, a conductor layer on the first resin insulating layer, and a second resin insulating layer formed on the first resin insulating layer such that the second resin insulating layer is covering the conductor layer. The conductor layer includes a first circuit having a width of 15 ?m or less and a rectangular cross-sectional shape, a second circuit having a trapezoidal cross-sectional shape, a third circuit, a fourth circuit, a fifth circuit, and a sixth circuit, a space between the first and third circuits has a width of 14 ?m or less, a space between the first and fourth circuits has a width of 14 ?m or less, a space between the second and fifth circuits has a width of 20 ?m or more, and a space between the second and sixth circuits has a width of 20 ?m or more.

Abstract: A semiconductor package includes a printed wiring board, a logic IC mounted on a first surface of the board, a connector mounted on a second surface of the board on the opposite side with respect to the first surface, an optical element that converts an optical signal and an electrical signal and positioned on the opposite side with respect to the first surface such that the optical element is at least partially embedded in the board, a path that is formed in the board and electrically connects the logic IC on the first surface and the optical element on the opposite side with respect to the first surface, and an optical waveguide that is embedded on the opposite side with respect to the first surface and optically connects the connector on the second surface and the optical element on the opposite side with respect to the first surface.