Patents Assigned to Ibiden Company, Ltd.
  • Patent number: 6967313
    Abstract: An object to provide a hot plate making it possible to heat an object to be heated uniformly, and the hot plate of the present invention is characterized in that a resistance element having a thickness dispersion of ±3 ?m or less is formed on an insulating substrate.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: November 22, 2005
    Assignee: Ibiden Company, Ltd.
    Inventors: Masakazu Furukawa, Yoshiyuki Ido
  • Publication number: 20040226935
    Abstract: A hot plate unit capable of uniformly cooling a hot plate within a short period of time. The hot plate unit (1) includes a hot plate (3) including a heating element (10) and a casing (2) that supports the hot plate. The hot plate and the casing define an internal space S1. Two intake ports (17) and two lower opened portions (31) are formed in the bottom wall (2a) of the casing.
    Type: Application
    Filed: February 12, 2004
    Publication date: November 18, 2004
    Applicant: Ibiden Company, Ltd.
    Inventors: Masakazu Furukawa, Yasutaka Ito
  • Patent number: 5017431
    Abstract: An adhesive made from a thermosetting resin composition consisting of (a) a condensed polycyclic aromatic compound, (b) an aromatic crosslinking agent and (c) an acid catalyst is applied to each surface of adherends treated with a particular surface treating agent and heated at a temperature of 100.degree.-400.degree. C. in an oxidizing or non-oxidizing atmosphere to produce an adhesion structure. In order to provide a conductive adhesion structure, a conductive promotion catalyst is included in the adhesive. Further, a carbonaceous or graphitic adhesion structure is obtained by carbonization or graphitization of the adhesion structure.
    Type: Grant
    Filed: January 3, 1990
    Date of Patent: May 21, 1991
    Assignee: Ibiden Company, Ltd.
    Inventors: Sugio Otani, Hiroya Kakegawa
  • Patent number: 4911983
    Abstract: An adhesive made from a thermosetting resin composition consisting of (a) a condensed polycyclic aromatic compound, (b) an aromatic crosslinking agent and (c) an acid catalyst is applied to each surface of adherends treated with a particular surface treating agent and heated at a temperature of 100.degree.-400.degree. C. in an oxidizing or non-oxidizing atmosphere to produce an adhesion structure. In order to provide a conductive adhesion structure, a conductive promotion catalyst is included in the adhesive. Further, a carbonaceous or graphitic adhesion structure is obtained by carbonization or graphitization of the adhesion structure.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: March 27, 1990
    Assignee: Ibiden Company, Ltd.
    Inventors: Sugio Otani, Hiroya Kakegawa