Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: Disclosed is a device for separating components (3, 20), in particular electronic components which are connected to a support such as a circuit board (1) by a fixing material such as solder and can be lifted from the support with the aid of a gripping element (17) under a preloaded force acting in the direction in which the components (3, 20) are to be lifted from the support. A lifting device (13) connected to the gripping element (17) causes the preloaded force to become effective when the fixing material reaches its melting temperature. The lifting device (17) is provided with a retaining member (9, 25, 31, 33) whose melting temperature is equal to or higher than that of the fixing material and which triggers the action of lifting the component (3, 20) when the fusible material melts.