Abstract: A thermal forcing system for controlling a temperature of a device under test (DUT) includes a thermal plate, heater, temperature sensor, cold head, actuator, and controller. The thermal plate is thermally coupleable to the DUT. The temperature sensor senses a temperature of the thermal plate. The cold head has a temperature which is lower than that of the thermal plate. The controller is configured to: receive information of the temperature sensed by the temperature sensor; determine a temperature difference between a setpoint temperature and the temperature sensed by the temperature sensor; and command the actuator to move the cold head relative to the thermal plate or command the heater to heat the thermal plate, in response to the temperature difference, so as to facilitate adjusting the temperature of the thermal plate, and consequently the DUT, to the setpoint temperature.

Abstract: An IC socket is pneumatically actuated and has an integrated heat sink. Thermally conductive elements of the heat sink extend through an opening of a pneumatically actuated element shaped as a closed curve of finite width so that heat radiating from the thermally conductive elements may dissipate through a top opening of the IC socket. Downward force exerted by the pneumatically actuated element is transferred through a gimbaled multi-plate and spring arrangement to provide even pressure on the die and substrate of an IC device being held in place by the IC socket. A spring-loaded ground tab on the bottom of the IC socket simplifies grounding of the IC socket to avoid damaging the held IC device by static discharge.