Patents Assigned to Indium Corporation
-
Patent number: 10010981Abstract: Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.Type: GrantFiled: September 29, 2008Date of Patent: July 3, 2018Assignee: Indium CorporationInventors: Ning-Cheng Lee, Runsheng Mao
-
Patent number: 9875983Abstract: A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 ?m to 1000 ?m. The sintering paste may be used in a pressureless sintering process to form a low porosity joint having high bond strength, high electrical and thermal conductivity, and high thermal stability.Type: GrantFiled: April 29, 2016Date of Patent: January 23, 2018Assignee: Indium CorporationInventors: Sihai Chen, Ning-Cheng Lee
-
Publication number: 20170317046Abstract: A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 ?m to 1000 ?m. The sintering paste may be used in a pressureless sintering process to form a low porosity joint having high bond strength, high electrical and thermal conductivity, and high thermal stability.Type: ApplicationFiled: April 29, 2016Publication date: November 2, 2017Applicant: Indium CorporationInventors: Sihai Chen, Ning-Cheng Lee
-
Patent number: 9802274Abstract: A lead-free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the shell coating layer is applied to a surface of the core wire. In another implementation, the lead free solder wire may include a first wire with a first alloy and a second wire with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the first alloy of the first wire and the second alloy of the second wire are braided together.Type: GrantFiled: March 21, 2016Date of Patent: October 31, 2017Assignee: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
-
Publication number: 20170271294Abstract: Methods and compositions are described for controlling bond line thickness of a joint formed during sintering. Spacer particles of a predetermined particle type and size are added in a predetermined concentration to a sintering paste to form a sintering paste mixture prior to sintering to achieve a targeted bond line thickness during sintering. The sintering paste mixture can be sintered under pressure and pressure-less process conditions. Under pressured sintering, the amount of pressure applied during sintering may be adjusted depending on the composition and concentration of the spacer particles to adjust bond line thickness.Type: ApplicationFiled: March 15, 2017Publication date: September 21, 2017Applicant: Indium CorporationInventors: Sihai Chen, Ning-Cheng Lee
-
Publication number: 20170266765Abstract: A lead—free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the shell coating layer is applied to a surface of the core wire. In another implementation, the lead free solder wire may include a first wire with a first alloy and a second wire with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the first alloy of the first wire and the second alloy of the second wire are braided together.Type: ApplicationFiled: March 21, 2016Publication date: September 21, 2017Applicant: Indium CorporationInventors: HONGWEN ZHANG, Ning-Cheng Lee
-
Patent number: 9741676Abstract: A lead-free solder alloy having a low melting temperature and low yield strength is disclosed. The solder alloy includes 5.0-20.0 wt. % of indium (In), 1.0-5.0 wt. % of silver (Ag), 0.25-2.0 wt. % of copper (Cu), 0.1-0.5 wt. % of zinc (Zn), and a remainder of tin (Sn). In implementations, a sulfur compound may be included in a concentration of 100 ppm to 500 ppm in the alloy to prevent oxidation of zinc and indium on the surface of the alloy. The solder alloy is particularly useful for but not limited to solder on pad applications in first level interconnect semiconductor device packaging.Type: GrantFiled: June 24, 2016Date of Patent: August 22, 2017Assignee: Indium CorporationInventors: Jianguo Luo, Ning-Cheng Lee
-
Publication number: 20170203393Abstract: A capillary block can be provided in any of a number of different geometries for soldering and brazing. The capillary block can be configured to be positioned adjacent a joint to be formed prior to heating. Heat can then be applied to melt the capillary block and cause it to wick into the interface between the members being joined. The capillary block can be used in place of or in addition to a frame preform to create a joint such as a wall-to-floor joint of an assembly.Type: ApplicationFiled: March 24, 2017Publication date: July 20, 2017Applicant: Indium CorporationInventors: Jordan Peter Ross, Bernard Allen Leavitt, JR.
-
Publication number: 20170203380Abstract: A capillary block can be provided in any of a number of different geometries for soldering and brazing. The capillary block can be configured to be positioned adjacent a joint to be formed prior to heating. Heat can then be applied to melt the capillary block and cause it to wick into the interface between the members being joined. The capillary block can be used in place of or in addition to a frame preform to create a joint such as a wall-to-floor joint of an assembly.Type: ApplicationFiled: January 20, 2016Publication date: July 20, 2017Applicant: Indium CorporationInventors: Jordan Peter Ross, Bernard Allen Leavitt, JR.
-
Patent number: 9636784Abstract: A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.Type: GrantFiled: March 10, 2015Date of Patent: May 2, 2017Assignee: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
-
Publication number: 20160325384Abstract: A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt. % of Bi and/or 0.1-4.5 wt. % of In may be included in the solder alloy.Type: ApplicationFiled: May 5, 2016Publication date: November 10, 2016Applicant: Indium CorporationInventors: Weiping Liu, Ning-Cheng Lee
-
Patent number: 9468136Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.Type: GrantFiled: January 16, 2014Date of Patent: October 11, 2016Assignee: Indium CorporationInventors: Jordan Peter Ross, Amanda Hartnett, Robert Norman Jarrett
-
Publication number: 20160057869Abstract: Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.Type: ApplicationFiled: August 24, 2015Publication date: February 25, 2016Applicant: Indium CorporationInventors: Zhenxi Wei, Lei Luo, Christopher John Nash, Derrick Matthew Herron
-
Patent number: 9260768Abstract: Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.Type: GrantFiled: December 6, 2006Date of Patent: February 16, 2016Assignee: Indium CorporationInventors: Weiping Liu, Ning-Cheng Lee
-
Patent number: 9190377Abstract: A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of <100° C.), a metal or alloy layer is deposited on the indium bump surface. Preferably, the material is chosen such that the metal or alloy forms a passivation layer that is more resistant to oxidation than the underlying indium material. The passivation material is also preferably chosen to form a low melting temperature alloy with indium at the indium bump surface. This is typically accomplished by diffusion of the passivation material into the indium to form a diffusion layer alloy. Various metals, including Ga, Bi, Sn, Pb and Cd, that can be used to form a binary to quaternary low melting point alloy with indium.Type: GrantFiled: June 24, 2011Date of Patent: November 17, 2015Assignee: Indium CorporationInventors: Sihai Chen, Ning-Cheng Lee
-
Patent number: 9175368Abstract: A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.Type: GrantFiled: July 5, 2012Date of Patent: November 3, 2015Assignee: Indium CorporationInventors: Weiping Liu, Ning-Cheng Lee
-
Publication number: 20150258638Abstract: Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux that is radiation curable or thermal curable to a substrate such that the solder flux covers contact pads on the substrate; placing solder balls on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.Type: ApplicationFiled: March 13, 2015Publication date: September 17, 2015Applicant: Indium CorporationInventors: Ming Hu, Ning-Cheng Lee
-
Publication number: 20150246417Abstract: A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.Type: ApplicationFiled: March 10, 2015Publication date: September 3, 2015Applicant: Indium CorporationInventors: HONGWEN ZHANG, Ning-Cheng Lee
-
Patent number: 9120930Abstract: A high emissive paint comprises organic materials with different functional groups, one or more inorganic materials, and optionally other paint property adjusting agents. The infrared absorption range of the paint derives from organic functional groups, such as C—C, C—H, N—H, C—N, C—O and C—X groups, and the one or more inorganic materials. One or more inorganic materials may also be present as micro- or nano-sized particles.Type: GrantFiled: October 18, 2012Date of Patent: September 1, 2015Assignee: Indium CorporationInventors: Sihai Chen, Ning-Cheng Lee
-
Publication number: 20150224602Abstract: A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.Type: ApplicationFiled: February 23, 2015Publication date: August 13, 2015Applicant: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee