Patents Assigned to Industry-University Cooperation Foundation Hanyang Univ.
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Patent number: 11239175Abstract: A semiconductor package includes: a substrate; a semiconductor chip disposed on a first surface of the substrate; solder bumps disposed between a first surface of the semiconductor chip and the substrate; and a redistribution layer provided on a second surface, opposite to the first surface, of the semiconductor chip. The substrate includes substrate patterns, and the substrate patterns cover a second surface of the substrate. The substrate patterns cover 60% to 100% of a total area of the second surface of the substrate.Type: GrantFiled: May 4, 2020Date of Patent: February 1, 2022Assignees: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVInventors: Young-Ho Kim, Hwan Pil Park, Sung-Chul Kim, Key-One Ahn
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Publication number: 20200402915Abstract: A semiconductor package includes: a substrate; a semiconductor chip disposed on a first surface of the substrate; solder bumps disposed between a first surface of the semiconductor chip and the substrate; and a redistribution layer provided on a second surface, opposite to the first surface, of the semiconductor chip. The substrate includes substrate patterns, and the substrate patterns cover a second surface of the substrate. The substrate patterns cover 60% to 100% of a total area of the second surface of the substrate.Type: ApplicationFiled: May 4, 2020Publication date: December 24, 2020Applicant: Industry-University Cooperation Foundation Hanyang UnivInventors: Young-Ho KIM, HWAN PIL PARK, SUNG-CHUL KIM, KEY-ONE AHN
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Patent number: 10347918Abstract: A surface-treated cathode active material useful for manufacturing a lithium secondary battery have excellent output characteristics by performing a double coating with metal oxide and an electron and ion conductive polymerized copolymer on a surface of a cathode active material for a lithium secondary battery to enhance electrochemical properties and thermal stability of the cathode active material.Type: GrantFiled: November 7, 2014Date of Patent: July 9, 2019Assignees: HYUNDAI MOTOR COMPANY, IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIV.)Inventors: Kyo Min Shin, Sa Heum Kim, Dong Gun Kim, Yun Chae Jung, Dong Won Kim, Ik Su Kang, Yoon Sung Lee
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Patent number: 8946762Abstract: A light emitting diode includes a first semiconductor layer, an active layer, and a second semiconductor layer sequentially stacked on a substrate, and a first electrode connected to the first semiconductor layer. The first electrode includes an edge electrode including first and second edge portions opposite to each other, and a line electrode including first and second line portions respectively extending from the first and second edge portions. The edge electrode has a closed loop-shape. A distance between the first line portion and the second edge portion is equal to or less than a quarter of a length of the first line portion. A distance between the second line portion and the first edge portion is equal to or less than a quarter of a length of the second line portion.Type: GrantFiled: August 20, 2013Date of Patent: February 3, 2015Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Hanyang Univ.Inventors: Jongbae Kim, Jong-In Shim, Hyunsung Kim, Il-Gyun Choi
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Publication number: 20140048840Abstract: A light emitting diode includes a first semiconductor layer, an active layer, and a second semiconductor layer sequentially stacked on a substrate, and a first electrode connected to the first semiconductor layer. The first electrode includes an edge electrode including first and second edge portions opposite to each other, and a line electrode including first and second line portions respectively extending from the first and second edge portions. The edge electrode has a closed loop-shape. A distance between the first line portion and the second edge portion is equal to or less than a quarter of a length of the first line portion. A distance between the second line portion and the first edge portion is equal to or less than a quarter of a length of the second line portion.Type: ApplicationFiled: August 20, 2013Publication date: February 20, 2014Applicants: Industry-University Cooperation Foundation Hanyang Univ., Electronics and Telecommunications Research InstituteInventors: Jongbae KIM, Jong-In Shim, Hyunsung Kim, Il-Gyun Choi
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Patent number: 8629852Abstract: Provided are a touch screen and a method for compensating sensing capacitance variations and offset variations thereof. The touch screen includes: a touch panel where a plurality of driving lines and a plurality of sensing lines intersect and are wired; a driving unit for activating the driving lines sequentially; an input unit for measuring a sensing capacitance formed in a sensing line corresponding to an activated driving line; a multiplexer for serializing and outputting the measured sensing capacitance; an analog-to-digital converter for sampling the sensing capacitance outputted from the multiplexer by reflecting an initial sensing capacitance as an offset and performing analog-to-digital conversion for the sampling result; and a host processor for determining a touch event in response to the analog-to-digital conversion result.Type: GrantFiled: September 9, 2010Date of Patent: January 14, 2014Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Hanyang Univ.Inventors: Oh-Kyong Kwon, Jang Hyun Park, Yea Chul Roh, Chang Sun Kim
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Publication number: 20130143490Abstract: A data transmitting and receiving apparatus includes a coil configured to transmit and receive data through inductive coupling, where a voltage drop across the coil constitutes a sensing signal. The apparatus further includes an input unit configured to generate transmission data and a replica signal in accordance with an input data signal, the transmission data being supplied to the coil. The apparatus still further includes a replica unit configured to generate a compensation signal in accordance with the replica signal, and an output unit configured to extract reception data from the sensing signal using the compensation signal.Type: ApplicationFiled: September 6, 2012Publication date: June 6, 2013Applicants: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIV, SAMSUNG ELECTRONICS CO., LTD.Inventors: CHUL BUM KIM, JANGWOO LEE, CHANGSIK YOO, MINKI JEON
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Patent number: 8018267Abstract: Provided is a frequency conversion mixer. The frequency conversion mixer includes a transconductance stage, a switching stage, a load stage, a current bleeding circuit, and a bias stage. The transconductance stage receives an RF signal, and outputs a current corresponding to a voltage of the RF signal. The switching stage switches the current which is outputted from the transconductance stage in response to a local oscillation signal, for frequency conversion the RF signal into an intermediate frequency (IF) signal. The load stage is connected between the switching stage and a supply voltage terminal. The current bleeding circuit is connected parallel with the switching stage, especially, embodying inverter structure with transconductance stage to get not only current bleeding effect but also current reuse effect, and one resonant inductor for reducing noise which is generated in parasitic capacitance at node between transconductance stage and switching stage.Type: GrantFiled: June 18, 2010Date of Patent: September 13, 2011Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Hanyang Univ.Inventors: Yun-mo Kang, Tae-yeoul Yun, Hee-woo An, Chang Sun Kim, Yea Chul Roh, Seong Hoon Choi
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Publication number: 20110178770Abstract: Provided is a method and apparatus for measuring efficiency of an optical device. In the method, a power of emission light from the optical device is calculated by irradiating an excitation stimulus on the optical device. A power of a reference excitation stimulus at which a variation of recombination coefficients in a quantum well of the optical device with respect to a variation of carrier concentration in the quantum well of the optical device becomes minimum is extracted. An internal quantum efficiency of the optical device at the power of the reference excitation stimulus is calculated. An internal quantum efficiency of the optical device at powers of various excitation stimuli is calculated from the internal quantum efficiency of the optical device at the power of the reference excitation stimulus.Type: ApplicationFiled: October 15, 2010Publication date: July 21, 2011Applicant: Industry-University Cooperation Foundation Hanyang UnivInventors: Jong-In SHIM, Hyunsung KIM
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Publication number: 20110148478Abstract: Provided is a frequency conversion mixer. The frequency conversion mixer includes a transconductance stage, a switching stage, a load stage, a current bleeding circuit, and a bias stage. The transconductance stage receives an RF signal, and outputs a current corresponding to a voltage of the RF signal. The switching stage switches the current which is outputted from the transconductance stage in response to a local oscillation signal, for frequency conversion the RF signal into an intermediate frequency (IF) signal. The load stage is connected between the switching stage and a supply voltage terminal. The current bleeding circuit is connected parallel with the switching stage, especially, embodying inverter structure with transconductance stage to get not only current bleeding effect but also current reuse effect, and one resonant inductor for reducing noise which is generated in parasitic capacitance at node between transconductance stage and switching stage.Type: ApplicationFiled: June 18, 2010Publication date: June 23, 2011Applicants: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Hanyang Univ.Inventors: Yun-mo KANG, Tae-yeoul YUN, Hee-woo AN, Chang Sun KIM, Yea Chul ROH, Seong Hoon CHOI
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Publication number: 20110140280Abstract: A semiconductor apparatus and a design method for the semiconductor apparatus allow debugging or repairs by using a spare cell. The semiconductor apparatus includes a plurality of metal layers. At least one repair block performs a predetermined function. A spare block is capable of substituting for a function of the repair block. And at least one of the plurality of metal layers is predetermined to be a repair layer for error revision. At least one pin of the repair block is connected to the repair layer through a first pin extension, and at least one pin of the spare block is capable of extending to the repair layer. When the repair block is to be repaired, the pin extension of the repair layer and the repair block is disconnected, and at least one pin of the spare block is connected to the repair layer through a second pin extension.Type: ApplicationFiled: December 1, 2010Publication date: June 16, 2011Applicants: Samsung Electronics Co., Ltd., IUCF-HYU (Industry - University Cooperation Foundation Hanyang Univ.)Inventors: Dong-Yun Kim, Dong-Hoon Yeo, Hyun-Chul Shin, Kyung-Ho Kim, Byung-Tae Kang, Ju-Yong Shin, Sung-Chul Lee
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Publication number: 20110109585Abstract: Provided are a touch screen and a method for compensating sensing capacitance variations and offset variations thereof. The touch screen includes: a touch panel where a plurality of driving lines and a plurality of sensing lines intersect and are wired; a driving unit for activating the driving lines sequentially; an input unit for measuring a sensing capacitance formed in a sensing line corresponding to an activated driving line; a multiplexer for serializing and outputting the measured sensing capacitance; an analog-to-digital converter for sampling the sensing capacitance outputted from the multiplexer by reflecting an initial sensing capacitance as an offset and performing analog-to-digital conversion for the sampling result; and a host processor for determining a touch event in response to the analog-to-digital conversion result.Type: ApplicationFiled: September 9, 2010Publication date: May 12, 2011Applicants: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Hanyang Univ.Inventors: Oh-Kyong KWON, Jang Hyun Park, Yea Chul Roh, Chang Sun Kim