Patents Assigned to Infineon Technologioes AG
  • Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
    Patent number: 10199255
    Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologioes AG
    Inventors: Ingo Muri, Alexander Binter, Bernhard Goller, Christian Grindling