Abstract: A method and apparatus for correction of temperature-induced variations in the analog output characteristics of a microbolometer detector in an infrared detecting focal plane array utilizing electronic means to correct for the temperature variation of the individual microbolometer detector. The electronic circuitry and associated software necessary for implementation is also described.
Abstract: A method and apparatus for correction of temperature-induced variations in the analog output characteristics of a microbolometer detector in an infrared detecting focal plane array utilizing electronic means to correct for the temperature variation of the individual microbolometer detector. The electronic circuitry and associated software necessary for implementation is also described.
Abstract: A frequency matched signal conduit apparatus wherein a micro-strip feed fabricated onto a material consistent with long vacuum life applications, such as ceramic or other crystalline materials, is used with a vacuum vessel signal interconnect, electrically connected to the micro-strip feed, comprising thermally resistive, electrically conductive material that provides high thermal isolation and low signal loss, for electrically connecting the micro-strip feed network to a device to be cooled.
Abstract: A method of making and a bellows cold shield wherein only the focused IR energy from the optical system of an IR detector will reach the detector or focal plane array, FPA, and all other radiation will be redirected from reaching the FPA through the use of a bellows cold shield having a predetermined geometrical surface which reflects the undesired light energy away from the FPA, and a microrough interior surface of this geometrical shape which absorbs any of the undesired light energy which is not so reflected away.
Type:
Grant
Filed:
February 9, 1998
Date of Patent:
November 30, 1999
Assignee:
Infrared Components Corporation
Inventors:
Thomas H. Clynne, Lawrence W. Bossert, Jonathan P. Knauth, Michael L. Robinson
Abstract: A cryogenic package provides a cryogenic environment for devices that require temperatures of 150 K or below, with uniform cooling and minimal thermal stress. A cryocooler produces cold gas on a closed loop, and the gas is distributed in the chamber of a cryogenic vessel. The device housed in the chamber is bathed in a continuous flow of the gas. The warmed gas is returned to the cryogenic cooler.