Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.

Abstract: An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.

Abstract: An optical transceiver module includes an optical fiber and an optical fiber positioning structure that fixes the optical fiber. The optical fiber positioning structure includes a first positioning part that fixes the said optical fiber, and a first supporting part that fixes the first positioning part on a case of the optical transceiver module. The first positioning part includes a first end face and a second end face opposite to one another, and a first through-hole that connects the first and second end faces. The inner diameter of the first through-hole is substantially equal to the diameter of the optical fiber, and the optical fiber is fixed within the first through-hole. The first supporting part includes an accommodating portion for accommodating the first positioning part. The first positioning part is fixed in the accommodating portion.

Abstract: An optical module with a dual layer printed circuit board assembly (PCBA) structure. The optical module includes a first casing and a second casing, and a first PCBA board and a second PCBA board located between the first casing and the second casing, a plurality of power components arranged on opposing surfaces of at least one of the first PCBA board and the second PCBA board, a layer of thermal superconducting medium of a bent arrangement including a first thermal conducting part and a second thermal conducting part arranged opposite to each other, the first thermal conducting part being thermally connected to the power component, and the second thermal conducting part being thermally connected to at least one of the first casing and the second casing, and at least one insulating layer arranged between the layer of thermal superconducting medium and the power components.

Abstract: An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.

Abstract: A laser driver for a laser, which includes an adjustable DC-DC power source, an optical power control loop, and a power source voltage regulator. The adjustable DC-DC power source is coupled to the optical power control loop and the power source voltage regulator, in order to provide a working current for the laser. The optical power control loop is configured to adjust the output optical power of the laser to a set value for optical power by adjusting a working voltage of the laser, and to generate a power source voltage state indicator voltage. The power source voltage regulator is used to generate the power source setting voltage, so that the power source voltage state indicator voltage is greater than or equal to a first preset threshold, or less than or equal to a second preset threshold.

Abstract: An optical transceiver module includes a first flexible circuit board and a second flexible circuit board; a light receiving unit and a light transmitting unit disposed on the first flexible circuit board and the second flexible circuit board, respectively; a printed circuit board connected to the first flexible circuit board and the second flexible circuit board, and including a connecting point; and a signal processing unit disposed on at least one of the first flexible circuit board, the second flexible circuit board, and the printed circuit board. The signal processing unit processes optical signals received by the light receiving unit and transmits the signals to the connecting point of the printed circuit board, and processes electrical signals transmitted from the connecting point of the printed circuit board and transmits the signals out through the light transmitting unit.

Abstract: This disclosure provides an optical assembly, comprising a base body and a wave filtering apparatus. A first slot is disposed on an upper surface of the base body. A total internal reflection surface and a connecting part are formed in the first slot. The total internal reflection surface reflects collimated light formed by a first lens from a light emitting apparatus. The wave filtering apparatus comprises a first part removably connected to the connecting portion, and a second portion forming a beam splitting surface. The wave filtering apparatus has a light-pervious optical coating at least on the beam splitting surface of the apparatus, and is configured to split the collimated light reflected from the total internal reflection surface into a first beam and a second beam. The first beam travels towards the side where the third lens is located, and the second beam travels towards a photoelectric detection apparatus.

Abstract: A surface mount packaging structure for semiconductor optical device and packaging method. A semiconductor optical device, disposed on a substrate, is electrically connected with a substrate through wires. A lower surface of the substrate is fixed on an upper surface of a flexible printed board that is provided with internal leads and external leads. The internal leads are electrically connected with the substrate through wires. A lower surface of the flexible printed board is fixed on a base board. A glass baffle is provided to form a window in front of a light-emitting or light-receiving surface of the semiconductor optical device. A focusing lens is adhered to the window of the glass baffle and is coupled with an optical path of the semiconductor optical device. The substrate and the semiconductor optical device thereon, the wires, and the internal leads on the flexible printed board are encased into packaging material.