Abstract: The present disclosure provides a display panel, the display panel includes a flexible substrate with a curve region, the curve region has a Gauss curvature K1, the Gauss curvature K1 is not equal to zero, a plurality of thin film transistors disposed on the flexible substrate, and a plurality of light emitting units disposed on the flexible substrate and driven by the thin film transistors, the flexible substrate at least has an opening in the curve region.

Abstract: A display device having a substrate; a first thin film transistor (TFT) on the substrate, the first TFT having a first active layer, a first gate insulator, and a first gate electrode; a second TFT on the substrate, the second TFT having a second active layer, a second gate insulator and a second gate electrode. The first gate insulator is disposed between the first gate electrode and the first active layer, and the first gate insulator is in contact with the first active layer. The second gate insulator is disposed between the second gate electrode and the second active layer, and the second gate insulator is in contact with the second active layer. The first active layer is a different material than the second active layer, and a hydrogen concentration of the second gate insulator is less than a hydrogen concentration of the first gate insulator.

Abstract: An electronic device includes a rollable panel and a metal layer. The rollable panel includes a first portion and a second portion. The rollable panel has a first side and a second side opposite to the first side. The rollable panel includes a substrate, a circuit layer disposed on the substrate and a cover layer disposed on the circuit layer. The metal layer is disposed on one of the first side and the second side of the rollable panel and outside the rollable panel. In a rolled mode, at least a part of the metal layer is positioned between the first portion and the second portion of the rollable panel.

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a substrate, a plurality of first electrodes, a plurality of second electrodes and a third electrode. The plurality of first electrodes are disposed on the substrate. The plurality of second electrodes are disposed on the substrate. The third electrode is disposed on the plurality of first electrodes and the plurality of second electrodes, and includes a plurality of openings. The electronic modulating device is an antenna device. One of the plurality of openings is disposed corresponding to one of the plurality of first electrodes, and an area of the one of the plurality of openings is different from an area of another one of the plurality of openings.

Abstract: A tiled display device includes two panels and two cover layers respectively disposed on the two panels. The two cover layers include a contact region. A top portion and a bottom portion of the contact region have a height H. One of the two cover layers has a thickness Tn. One of the two panels has a distance Xn between an upper surface of the one of the two panels and the bottom portion of the contact region. The one of the two panels is corresponding to the one of the two cover layers. The height H, the thickness Tn and the distance Xn satisfy the equation: 0<H/(Xn+Tn)<0.8.

Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

Abstract: An electronic device includes a photodiode, a switching circuit, a readout circuit, and an energy storage device. The photodiode includes a first terminal and a second terminal and is configured to generate a signal according to a light. The switching circuit is electrically connected to the first terminal and the second terminal. When the electronic device operates in a sensing mode, the switching circuit electrically isolates the photodiode from the energy storage device so that the signal is provided to the readout circuit. When the electronic device operates in a charging mode, the switching circuit electrically connects the photodiode to the energy storage device so that the signal is provided to the energy storage device.

Abstract: A display device includes a substrate and a plurality of pixels disposed on the substrate is provided by the present disclosure. The substrate has an edge, wherein the edge extends along a first direction. The plurality of pixels include a first pixel closest to the edge and a second pixel adjacent to the first pixel, wherein the first pixel and the second pixel are arranged along a second direction perpendicular to the first direction, and any one of the first pixel and the second pixel includes a plurality of sub-pixels arranged along the first direction. A width of the first pixel is less than a width of the second pixel in the second direction.

Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.

Abstract: An electronic device with a first region and a second region located around the first region is disclosed. The electronic device includes a first gate driver and a second gate driver disposed in the second region, and a first transistor and a second transistor disposed in the first region. The first gate driver is used for outputting a first signal. The second gate driver is used for outputting a second signal. The first transistor is used for receiving the first signal from the first gate driver. The second transistor is used for receiving the second signal from the second gate driver. In a top view of the electronic device, the first region has a first side and a second side opposite to the first side, and the first gate driver and the second gate driver are located more adjacent to the first side and away from the second side.

Abstract: An electronic includes an electronic element, an encapsulation layer surrounding the electronic element, a first circuit structure, a second circuit structure and a connecting structure. The encapsulation layer has a top surface, a bottom surface and an opening, wherein a sidewall of the opening connects the top surface and the bottom surface. The first circuit structure is disposed at the top surface of the encapsulation layer. The second circuit structure is disposed at the bottom surface of the encapsulation layer. The connecting structure is disposed in the opening, wherein the electronic element is electrically connected to the second circuit structure through the first circuit structure and the connecting structure. The connecting structure includes a first sub layer and a second sub layer, the first sub layer is located between the encapsulation layer and the second sub layer, and the first sub layer covers the sidewall of the opening.

Abstract: An electronic device includes a color module and a control module. The color module includes a first sub-pixel and a second sub-pixel. The first sub-pixel and the second sub-pixel are adjacent and have different colors. The control module is configured to convert an input data to an output data. The input data includes a first grayscale value of a first color. The output data includes the first grayscale value of the first color and a second grayscale value of a second color, and the first color and the second color are different. The first grayscale value of the output data is provided to the first sub-pixel, and the second grayscale value of the output data is provided to the second sub-pixel.

Abstract: An electronic device is provided. The electronic device includes a plurality of units. The plurality of units includes a first unit. The first unit includes a first electronic component and a test circuit. The test circuit is electrically connected to the first electronic component. The test circuit includes a coil circuit.

Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.

Abstract: An electronic device including a protective substrate is provided. The protective substrate includes a substrate and an anti-reflection layer. The anti-reflection layer is disposed on the substrate. The anti-reflection layer includes a first sublayer to an nth sublayer sequentially arranged on the substrate, where n is greater than 1, and a product range of a thickness and a refractive index of the nth sublayer ranges from 100 nm to 170 nm.

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: A modulation device includes a substrate, an electrostatic discharge protection element, an electronic element, and a driving element. The substrate has an active region. The electrostatic discharge protection element is arranged around the active region. The electronic element is disposed in the active region. The driving element is electrically connected to the electronic element.

Abstract: An electronic device able to be operated with a first state and a second state includes a substrate and electronic units. In a top view, the substrate has a first area in the first state and a second area in the second state, and the second area is greater than the first area. The electronic units are disposed on the substrate. The number of the electronic units being in a mode of ON in the second state is greater than that in the first state. The electronic device has a PPA_1 that is defined as a number of the electronic units being in the mode of ON per unit area of the substrate while in the first state, and a PPA_2 that is defined as a number of the electronic units being in the mode of ON per unit area of the substrate while in the second state, 1.5×PPA_1?PPA_2?0.5×PPA_1.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.