Abstract: A tray for an integrated circuit comprising a thermosetting resin compound comprising 20 to 180 parts by weight of a filler with a water absorption of 0.45% or less and 15 to 45 parts by weight of electroconductive carbon black added to 100 parts by weight of a thermosetting resin with a water adsorption of 0.45% or less, desirably with 5 to 15 parts by weight of an acrylonitrile-butadiene type rubber, said tray having a surface resistance of 10.sup.2 to 10.sup.6 .OMEGA., a water absorption of 0.45% or less than a glass transition temperature of 150.degree. C. or higher.

Abstract: Coating composition and skinned polyurethane foam articles coated with such composition, wherein the composition composed of a combination of [I] a two component type non-yellowing polyurethane, for top coat, comprising a OH-terminated urethane prepolymer and a non-aromatic polyisocyanate, and [II] a two component type polyurethane, for under coat, comprising an NCO-terminated urethane prepolymer and a polyol.