Abstract: Methods of manufacture of interconnection devices that include using a non-forming process to manufacture a plurality of compression contacts, each compression contact including a cantilevered beam portion that is tapered along its length, and disposing each of the plurality of contacts within a respective cavity in a substantially planar carrier housing lying in a plane defined by x and y axes, the housing having an upper surface and a lower surface, each cavity extending between the upper and lower surfaces of the housing substantially along a z axis, each contact being loosely retained within its respective cavity such that an entirety of the contact in a compressed state has at least some freedom of movement along the x and y axes.

Abstract: An interconnection device includes a carrier housing formed of non-conductive material and has at least one cavity extending through the housing. Within the cavity is disposed a non-formed compression contact that has a cantilevered beam portion that is tapered along its length. The may be tapered such that that deflection of the beam occurs across substantially the entire length of the beam when a compression force is applied to the contact. The contact may be installed in the housing such that it has some freedom of movement in the x, y, and z directions.