Abstract: The present disclosure generally provides for an integrated circuit (IC) structure with a TSV, and methods of manufacturing the IC structure and the TSV. An IC structure according to embodiments of the present invention may include a through-semiconductor via (TSV) embedded within a substrate, the TSV having an axial end; and a metal cap contacting the axial end of the TSV, wherein the metal cap has a greater electrical resistivity than the TSV.

Abstract: A method is provided for responding to a resource request from a requesting user node in a network of user nodes. According to the method, a response to the resource request is received at a first user node of the network, and it is determined (e.g., randomly) whether or not to send the response back to the requesting user node. When it is determined not to send the response to the requesting user node, the response is forwarded to a second user node of the network through a direct connection. When it is determined to send the response to the requesting user node, the response is sent back to the requesting user node. Also provided is a user node for use in a computer network having user nodes that are each connected to other user nodes through direct connections.