Patents Assigned to Invensense Inc.
  • Patent number: 11151355
    Abstract: In a method for generating an estimated fingerprint image, a ridge/valley pattern of a fingerprint of a finger is received. A sensor image including a partial fingerprint of the finger is received. Ridge/valley characteristics of the fingerprint are extracted from the sensor image including the partial fingerprint. An estimated fingerprint image is generated based at least on the ridge/valley pattern of the fingerprint and the ridge/valley characteristics of the fingerprint.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: October 19, 2021
    Assignee: InvenSense, Inc.
    Inventors: Jonathan Baudot, Etienne De Foras
  • Patent number: 11125580
    Abstract: A MEMS inertial sensor may include drive electrodes that apply a drive signal to a suspended spring-mass system for measurement of an inertial linear or angular force and self-test electrodes that apply a self-test signal to the suspended spring-mass system for monitoring the characteristics of the suspended spring-mass system during operation. The self-test signal may be modulated by a spreading sequence that prevents interference with the self-test signal by vibrations and other disturbance signals. The self-test signals and drive signals may be modulated with CDMA code sequences to multiplex signals that are at least partially processed by a common sense path.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: September 21, 2021
    Assignee: InvenSense, Inc.
    Inventors: Vito Avantaggiati, Adolfo Giambastiani
  • Patent number: 11125560
    Abstract: An optimal demodulation phase for extracting an in-phase component of a MEMS gyroscope output signal is determined through a test procedure. During the test procedure, multiple different rotation rate patterns such as different directions of rotation and different rotation rates are applied to the MEMS gyroscope while the MEMS gyroscope output signal is demodulated based on demodulation phases near a predicted quadrature phase for the MEMS gyroscope. The measured gyroscope outputs are used to calculate an optimal demodulation phase for the MEM gyroscope.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 21, 2021
    Assignee: InvenSense, Inc.
    Inventors: Pietro Scafidi, Luca Coronato
  • Publication number: 20210286060
    Abstract: In a method for operating a fingerprint sensor including a plurality of ultrasonic transducers and a presence sensor, the presence sensor proximate the fingerprint sensor is activated, where the presence sensor is for detecting interaction between an object and the fingerprint sensor. Subsequent to detecting interaction between an object and the fingerprint sensor at the presence sensor, a subset of ultrasonic transducers of the fingerprint sensor is activated, the subset of ultrasonic transducers for determining whether the object is a human finger, where the subset of ultrasonic transducers is proximate the presence sensor such that the subset of ultrasonic transducers and the presence sensor can concurrently interact with the object.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 16, 2021
    Applicant: InvenSense, Inc.
    Inventors: Mark JENNINGS, Romain FAYOLLE, Amaury ROBLES, Pierre PEIFFER
  • Patent number: 11118907
    Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: September 14, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joe Seeger
  • Publication number: 20210278927
    Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, a contact layer, a matching layer between the two-dimensional array and the contact layer, where the matching layer has a non-uniform thickness, and an array controller configured to control activation of ultrasonic transducers during an imaging operation for imaging a plurality of pixels within the two-dimensional array of ultrasonic transducers. During the imaging operation, the array controller is configured to activate different subsets of ultrasonic transducers associated with different regions of the two-dimensional array of ultrasonic transducers at different transmission frequencies, where the different frequencies are determined such that a thickness of the matching layer at a region is substantially equal to a quarter wavelength of the first transmission frequency for the region.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 9, 2021
    Applicant: InvenSense, Inc.
    Inventors: Mark JENNINGS, Mei-Lin CHAN
  • Patent number: 11112388
    Abstract: In a method of using an ultrasonic sensor comprising a two-dimensional array of ultrasonic transducers, a plurality of ultrasonic signals are transmitted according to a beamforming pattern at a position of the two-dimensional array. The beamforming pattern focuses the plurality of ultrasonic signals to location above the two-dimensional array, wherein the beamforming pattern identifies ultrasonic transducers of the two-dimensional array that are activated during transmission of the ultrasonic signals, and wherein at least some ultrasonic transducers of the beamforming pattern are phase delayed with respect to other ultrasonic transducers of the beamforming pattern. At least one reflected ultrasonic signal is received at the position according to a receive pattern, wherein the receive pattern identifies at least one ultrasonic transducers of the two-dimensional array that is activated during the receiving. The transmitting and the receiving are repeated at a plurality of positions of the two-dimensional array.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: September 7, 2021
    Assignee: InvenSense, Inc.
    Inventors: Bruno W. Garlepp, Michael H. Perrott, James Christian Salvia
  • Patent number: 11107858
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 31, 2021
    Assignee: InvenSense, Inc.
    Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd
  • Patent number: 11092616
    Abstract: A microelectromechanical (MEMS) sensor has a capacitance that varies based on a sensed force. A charge signal representing that capacitance is provide at an input node of an amplifier of a sense circuit. The sense circuit includes a filter and analog-to-digital converter. Feedback from the filter and the analog-to-digital converter is also received at the input node of the amplifier. The sense circuit outputs a digital signal that is representative of the sensed force.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: August 17, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Omid Oliaei, Peter George Hartwell
  • Patent number: 11092988
    Abstract: A start-up speed enhancement circuit and method for lower-power regulators is provided herein. Operations of a method can comprise detecting a condition of a power regulator being a start-up condition and applying a first current and a second current to the power regulator based on the start-up condition. The method can also comprise determining the condition of the power regulator changes from the start-up condition to an operation condition. Further, the method can comprise stopping application of the second current to the power regulator based on the condition being the operation condition.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: August 17, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Le Jin, Pradeep Shettigar, Pablo Moreno Galbis
  • Patent number: 11085770
    Abstract: Reducing, at a common sense electrode of a group of sensors of a system, a common charge flow due to a common motion of the group of sensors is presented herein. The group of electromechanical sensors generates a common charge flow as a result of a common motion of the group of electromechanical sensors and a differential charge flow as a result of a differential motion of the group of electromechanical sensors—respective sense elements of the group of electromechanical sensors being electrically connected at the common sense electrode. The system further comprises a voltage-to-voltage converter component that generates, via an output of the voltage-to-voltage converter component, a positive feedback voltage, and minimizes the common charge flow by coupling, via a defined feedback capacitance, the positive feedback voltage to the common sense electrode—the common sense electrode being electrically coupled to an input of the voltage-to-voltage converter component.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: August 10, 2021
    Assignee: INVENSENSE, INC.
    Inventor: Joseph Seeger
  • Patent number: 11073531
    Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: July 27, 2021
    Assignee: INVENSENSE, INC.
    Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
  • Patent number: 11076226
    Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: July 27, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Fariborz Assaderaghi, Peter Cornelius
  • Patent number: 11050416
    Abstract: Implementation of large temperature-insensitive resistance in CMOS using short-duty-clock cycle is provided herein. Operations of a method can comprise boosting a resistance level of a switched-resistor circuit to a defined resistance level. The boosting can comprise using a short-duty-cycle clock to facilitate the boosting. Also provided is a sensor system that can comprise a short-duty-cycle clock and a switched-resistor circuit. The short-duty cycle clock boosts a resistance level of the switched-resistor circuit to a defined resistance level.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: June 29, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Jialin Liu, Ming He, Richelle Smith
  • Patent number: 11048358
    Abstract: In a method for determining touch applied to an electronic device, ultrasonic signals are emitted from an ultrasonic sensor. A plurality of reflected ultrasonic signals from a finger interacting with the ultrasonic sensor is captured. A first data based at least in part on a first reflected ultrasonic signal of the plurality of reflected ultrasonic signals is compared with a second data based at least in part on a second reflected ultrasonic signal of the plurality of reflected ultrasonic signals. A signal change due to a deformation of the finger during a touch interaction with the ultrasonic sensor is determined based on differences between the first data and the second data. A touch applied by the finger to the electronic device is determined based at least in part on the signal change due to the deformation.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 29, 2021
    Assignee: InvenSense, Inc.
    Inventors: Eitan Medina, Behrooz Abdi, Sam Massih, Romain Fayolle, Hao-Yen Tang
  • Patent number: 11047685
    Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: June 29, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Ozan Anac, Joseph Seeger
  • Patent number: 11040871
    Abstract: A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 22, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Jongwoo Shin, Houri Johari-Galle, Bongsang Kim, Joseph Seeger, Dongyang Kang
  • Patent number: 11035915
    Abstract: Systems and methods are disclosed for generating a magnetic fingerprint map. Information representing orientation and position of each portable device is obtained along with magnetic field measurements that are correlated with positions determined from the information. Uncertainties associated with the magnetic field measurements are estimated and the magnetic field measurements and associated uncertainties are converted from a device frame to a unified fingerprint frame using the orientations determined from the information. Parameters of a probability distribution function for magnetic field measurements and contaminating measurements are mitigated at each determined position based at least in part on the converted magnetic field measurements and associated uncertainties. Correspondingly, the magnetic fingerprint map is generated from the determined parameters of the probability distribution functions.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 15, 2021
    Assignee: InvenSense, Inc.
    Inventors: Gennadii Berkovich, Dmitry Churikov
  • Patent number: 11026600
    Abstract: An activity classification device is disclosed. The activity classification device comprises one or more motion sensors and a memory configured to receive signals from the one or more motion sensors. The device further includes a processor in communication with the memory. Finally, the device includes a classification algorithm executed by the processor, the classification algorithm for identifying activities that a user is engaged in. The memory may also record a user's activity log, calorie count and an RF module, which transmits the recorded data to a host either upon request or continuously.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: June 8, 2021
    Assignee: InvenSense, Inc.
    Inventor: Jonathan E. Lee
  • Patent number: 11027967
    Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: June 8, 2021
    Assignee: InvenSense, Inc.
    Inventors: Chung-Hsien Lin, Joseph Seeger, Calin Miclaus, Tsung Lin Tang, Pei-Wen Yen