Patents Assigned to IRSPEC CORPORATION
  • Patent number: 8610170
    Abstract: An array structure solves issues that exist in conventional compound semiconductor photodiode arrays, such as large cross talk, large surface leaks, large stray capacitance, narrow detection wavelength bands, and bad manufacturing yield, simultaneously. A photodiode array has, laminated upon a semiconductor substrate, a buffer layer (8) with a broad forbidden band width, an I-type (low concentration photosensitive layer (2) with a narrow forbidden band width, and an n-type semiconductor window layer (3) with a broad forbidden band width, wherein photodiode elements are electrically separated from adjacent elements, by doping the periphery of the p-type impurity, and the detection wavelength band is expanded, by making the n-type window layer (3) on the photosensitive layer (2) a thinner layer with crystal growth.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: December 17, 2013
    Assignee: Irspec Corporation
    Inventors: Katsuhiko Nishida, Mutsuo Ogura
  • Publication number: 20120286328
    Abstract: An array structure solves issues that exist in conventional compound semiconductor photodiode arrays, such as large cross talk, large surface leaks, large stray capacitance, narrow detection wavelength bands, and bad manufacturing yield, simultaneously. A photodiode array has, laminated upon a semiconductor substrate, a buffer layer (8) with a broad forbidden band width, an I-type (low concentration photosensitive layer (2) with a narrow forbidden band width, and an n-type semiconductor window layer (3) with a broad forbidden band width, wherein photodiode elements are electrically separated from adjacent elements, by doping the periphery of the p-type impurity, and the detection wavelength band is expanded, by making the n-type window layer (3) on the photosensitive layer (2) a thinner layer with crystal growth.
    Type: Application
    Filed: January 11, 2011
    Publication date: November 15, 2012
    Applicant: IRSPEC CORPORATION
    Inventors: Katsuhiko Nishida, Mutsuo Ogura