Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

Abstract: In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

Abstract: A semiconductor package includes a die pad; a plurality of external connection terminals located around the die pad; a semiconductor chip located on a top surface of the die pad and electrically connected with the plurality of external connection terminals; and a sealing member covering the die pad, the plurality of external connection terminals and the semiconductor chip and exposing an outer terminal of each of the plurality of external connection terminals. A side surface of the outer terminal of each of the plurality of external connection terminals includes a first area, and the first area is plated.

Abstract: In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.

Abstract: Mash seam welding is performed to weld metal plates with thicknesses of 2 mm or more to stabilize the strength of a joint portion, reduce uneven parts of the joint portion, and ensure high strength and reliability of the joint portion. First, two metal plates, clamped with first and second clamping devices, are placed to overlap each other at their end portions. The overlapping portions (L) of the metal plates are pressed together with a pair of upper and lower electrode wheels while welding currents flow to continuously weld the overlapping portions (L) and join the metal plates. The pressing forces applied to the electrode wheels are controlled so that upper and lower welding forces acting upon the overlapping portions are equal to each other during the time when the overlapping portions are continuously welded.

Abstract: A disc holding apparatus including a plurality of movable holding claws, which have a holding section abutting to the outer circumference of a wafer having a notch and are arranged in the circumference direction of the wafer. The wafer is held by having each holding section on the inner edge side of each movable holding claw abut to the outer circumference of the wafer, thereby, at the time of detecting the notch by a sensor including a light source and a light receiving section, even when one of the holding sections abuts to the outer circumference of the wafer at a part where the notch exists, light from the light source is permitted to enter the light receiving section through the notch without being blocked by the holding section. Even when the wafer is held at the part where the notch exists, the wafer is not required to be correctly held again and throughput is improved with a shortened process time.

Abstract: A shuttle-type conveying system to convey an article. The system includes a feeding and collecting device capable of setting a cassette in which articles to be conveyed are stacked as they are on a rotating and feeding table, a pickup device taking out the article and placing it on a receiving/delivery table, and a conveying device feeding the article on the receiving/delivery table to another receiving/delivery table by a shuttle conveying portion traveling on conveying paths below the receiving/delivery table. After the article is lifted up by the shuttle conveying portion and moved to outside the receiving/delivery table, the article is lowered below the receiving/delivery table and made to travel under the receiving/delivery table to another receiving/delivery table.

Abstract: A shuttle-type conveying system to convey an article. The system includes a feeding and collecting device capable of setting a cassette in which articles to be conveyed are stacked as they are on a rotating and feeding table, a pickup device taking out the article and placing it on a receiving/delivery table, and a conveying device feeding the article on the receiving/delivery table to another receiving/delivery table by a shuttle conveying portion traveling on conveying paths below the receiving/delivery table. After the article is lifted up by the shuttle conveying portion and moved to outside the receiving/delivery table, the article is lowered below the receiving/delivery table and made to travel under the receiving/delivery table to another receiving/delivery table.

Abstract: A shuttle-type conveying system to convey an article. The system includes a feeding and collecting device capable of setting a cassette in which articles to be conveyed are stacked as they are on a rotating and feeding table, a pickup device taking out the article and placing it on a receiving/delivery table, and a conveying device feeding the article on the receiving/delivery table to another receiving/delivery table by a shuttle conveying portion traveling on conveying paths below the receiving/delivery table. After the article is lifted up by the shuttle conveying portion and moved to outside the receiving/delivery table, the article is lowered below the receiving/delivery table and made to travel under the receiving/delivery table to another receiving/delivery table.

Abstract: There is provided a novel storage system in which the number of signal lines will not increase even if the number of storage devices to be connected in a RAID system increases, and a novel data transfer method to enable a high-speed data transfer even when the transfer rate of the IDE device side is low. A RAID system (10) which is a storage system in which a RAID controller (11) connected to an ATA host and a plurality of IDE devices (12A to 12D, and 22A to 22D) are connected by an IDE bus, characterized in that at least two or more IDE devices are connected to one channel of the IDE bus and said RAID controller and each of said IDE devices are connected by a common data bus and a common address bus within the same channel.

Abstract: An object is to restrict vibration from being transmitted to a shelf member and thus to prevent a substrate supported on the shelf member from being damaged. An FOUP main body 3a is formed into a member separated from a shelf member 3e provided in the FOUP main body 3a, and then an elastic member 3g is interposed between the FOUP main body 3a and the shelf member 3e, thereby allowing the shelf member 3e to be elastically supported to the FOUP main body 3a.

Abstract: A disc holding apparatus including a plurality of movable holding claws, which have a holding section abutting to the outer circumference of a wafer having a notch and are arranged in the circumference direction of the wafer. The wafer is held by having each holding section on the inner edge side of each movable holding claw abut to the outer circumference of the wafer, thereby, at the time of detecting the notch by a sensor including a light source and a light receiving section, even when one of the holding sections abuts to the outer circumference of the wafer at a part where the notch exists, light from the light source is permitted to enter the light receiving section through the notch without being blocked by the holding section. Even when the wafer is held at the part where the notch exists, the wafer is not required to be correctly held again and throughput is improved with a shortened process time.

Abstract: An elevation conveyor 5 includes a turntable 17 and a roller conveyor 18. The roller conveyor 18 is supported onto the turntable 17. A turntable controller 7 turns the turntable 17 so that the roller conveyor 18 matches with a carrying direction of a conveyor rail for receiving or delivering a load and then drives the conveyor rail and the roller conveyor 18 to receive or deliver an FOUP 8. An elevation conveyor 5 is held in a cable 20a installed in an elevation space 9 through a coupling member 20b of a cableveyor 20, and can freely elevate and stop at a port 21 installed on each floor while being interlocked with motion of the cableveyor 20 caused by reciprocating circulation of the cableveyor 20 in a vertical direction by an elevation conveyor controller 4.

Abstract: Each storage provided for an storing apparatus is provided with: a driving device capable of reciprocating the load in a horizontal one direction and in a vertical direction; and a rack having a plurality of rack portions at a plurality of stages in the vertical direction, each stage including one or a plurality of rack portions in the horizontal one direction, the rack portion capable of accommodating or putting thereon the load to be displaced by the driving device. The storing apparatus is provided with a plurality of controllers, which control the loading and unloading in respective groups, each group comprising at least one or a plurality of storages of the plurality of the storages, and which can perform complementary control with each other.

Abstract: A plurality of conveying apparatuses ace arranged from the inside of the first building to the inside of the second building along a conveying direction. A plurality of connection mechanisms connect each pair of adjacent conveying apparatuses such that the conveying apparatuses are arranged in a meandering manner in a case where relative positions between the first building and the second building are changed.

Abstract: A storage (10) unloads and loads a load (3) with a transporting carriage (2). The storage is provided with a port capable of transferring said load from or to said transporting carriage; a plurality of rack portions (15) capable of accommodating or putting said load thereon; a driving device (19) capable of moving said load between said port and said plurality of rack portions, and mutually between said plurality of rack portions; and a controlling device (20) for controlling said driving device to (i) firstly move said load to an temporary rack portion for unloading, which is one of said plurality of rack portions, and (ii), after once accommodating or putting said load on said temporary rack portion, move said load to said port from said temporary rack portion, in case of moving said load from said plurality of rack portions to said port.