Patents Assigned to IV Technologies Co., Ltd.
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Patent number: 10040167Abstract: A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.Type: GrantFiled: August 1, 2016Date of Patent: August 7, 2018Assignee: IV Technologies CO., Ltd.Inventors: Ko-Wen Chen, Shih-Ming Yu
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Publication number: 20180200864Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.Type: ApplicationFiled: January 12, 2018Publication date: July 19, 2018Applicant: IV Technologies CO., Ltd.Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
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Publication number: 20180161959Abstract: A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.Type: ApplicationFiled: December 8, 2017Publication date: June 14, 2018Applicant: IV Technologies CO., Ltd.Inventors: Yu-Piao Wang, I-Ping Chen
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Patent number: 9969049Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.Type: GrantFiled: June 8, 2016Date of Patent: May 15, 2018Assignee: IV Technologies CO., Ltd.Inventors: Kun-Che Pai, Yu-Hao Pan
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Publication number: 20180009080Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.Type: ApplicationFiled: June 28, 2017Publication date: January 11, 2018Applicant: IV Technologies CO., Ltd.Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
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Publication number: 20170355061Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.Type: ApplicationFiled: June 1, 2017Publication date: December 14, 2017Applicant: IV Technologies CO., Ltd.Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
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Publication number: 20170334033Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.Type: ApplicationFiled: May 18, 2017Publication date: November 23, 2017Applicant: IV Technologies CO., Ltd.Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
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Patent number: 9707662Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: GrantFiled: November 1, 2013Date of Patent: July 18, 2017Assignee: IV TECHNOLOGIES CO., LTD.Inventors: Kun-Che Pai, Shiuan-Tzung Li, Chao-Chin Wang, Wei-Wen Yang
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Publication number: 20170036319Abstract: A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.Type: ApplicationFiled: August 1, 2016Publication date: February 9, 2017Applicant: IV Technologies CO., Ltd.Inventors: Ko-Wen Chen, Shih-Ming Yu
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Patent number: 9393665Abstract: A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.Type: GrantFiled: August 5, 2011Date of Patent: July 19, 2016Assignees: IV TECHNOLOGIES CO., LTD., POWERCHIP TECHNOLOGY CORPORATIONInventors: Yu-Piao Wang, Jen-Feng Cheng, Te-Yang Chen, Ya-Ling Chen
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Patent number: 8870626Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.Type: GrantFiled: May 16, 2012Date of Patent: October 28, 2014Assignee: IV Technologies Co., Ltd.Inventor: Yu-Piao Wang
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Patent number: 8721394Abstract: A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone.Type: GrantFiled: December 19, 2007Date of Patent: May 13, 2014Assignee: IV Technologies Co., Ltd.Inventor: Yu-Piao Wang
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Publication number: 20140057540Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: ApplicationFiled: November 1, 2013Publication date: February 27, 2014Applicant: IV Technologies Co., Ltd.Inventors: Kun-Che PAI, Shiuan-Tzung LI, Chao-Chin WANG, Wei-Wen YANG
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Patent number: 8609001Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: GrantFiled: June 8, 2010Date of Patent: December 17, 2013Assignee: IV Technologies Co., Ltd.Inventors: Kun-Che Pai, Shiuan-Tzung Li, Chao-Chin Wang, Wei-Wen Yang
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Patent number: 8517800Abstract: A method of fabricating a polishing pad for polishing an article is described. The method includes providing a semi-finished polishing pad and then forming a moving track on the surface of the semi-finished polishing pad. The moving track substantially coincides with a polishing track of the article on the polishing pad.Type: GrantFiled: October 28, 2008Date of Patent: August 27, 2013Assignee: IV Technologies Co., Ltd.Inventors: Shiuan-Tzung Li, Chao-Chin Wang, Hui-Che Chang
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Patent number: 8496512Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.Type: GrantFiled: October 10, 2012Date of Patent: July 30, 2013Assignee: IV Technologies Co., Ltd.Inventor: Yu-Piao Wang
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Patent number: 8480773Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.Type: GrantFiled: June 14, 2011Date of Patent: July 9, 2013Assignee: IV Technologies Co., Ltd.Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
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Patent number: 8398461Abstract: A polishing method, a polishing pad and a polishing system are provided. In the invention, the polishing pad is used to polish a polishing article. The polishing pad includes a polishing layer and a surface pattern disposed in the polishing layer. The polishing layer includes a polishing surface, a rotating central region, and a peripheral region. The surface pattern includes many grooves distributed from near the rotating central region and extending outward to near the peripheral region. The grooves include many groove cross sections along a circumferential direction of a same radius. Each of the groove cross sections has a left sidewall and a right sidewall. An included angle is formed by the polishing surface and one of a group of the left sidewalls and a group of the right sidewalls. The included angle is an obtuse angle.Type: GrantFiled: January 21, 2010Date of Patent: March 19, 2013Assignee: IV Technologies Co., Ltd.Inventor: Yu-Piao Wang
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Patent number: 8393936Abstract: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include structuring the retaining ring such that the width between inner and outer surfaces varies by an amount sufficient to compensate for polishing edge profile variation. Embodiments also include structuring the retaining ring such that the distance from the outer surface to the geometric inner surface varies. Embodiments further include structuring the retaining ring such that the distance between the outer surface to the perimeter of the substrate retained by the inner surface of the retaining ring varies.Type: GrantFiled: August 24, 2009Date of Patent: March 12, 2013Assignee: IV Technologies Co., Ltd.Inventor: Yu Piao Wang
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Patent number: RE46648Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.Type: GrantFiled: July 7, 2015Date of Patent: December 26, 2017Assignee: IV Technologies Co., Ltd.Inventor: Yu-Piao Wang