Abstract: A lead free, cadmium free tin and tin/antimony based solder alloy having a wide melting range for joining copper tubes and brass pipe and fittings. The non-toxic tin based solder composition has a range of 92.5-96.9% tin, 3.0-5.0% copper, 0.1-2.0% nickel and 0.0-5.0% silver. The non-toxic tin/antimony based solder composition has a range of 87.0-92.9% tin, 4.0-6.0% antimony, 3.0-5.0% copper, 0.0-2.0% nickel and 0.0-0.5% silver and is especially suited for plumbing applications having tight loose fitting solder joints which are exposed to potable water.
Type:
Grant
Filed:
June 29, 1987
Date of Patent:
July 19, 1988
Assignee:
J.W. Harris Company
Inventors:
Richard E. Ballentine, Joseph W. Harris
Abstract: A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.1-3.0% silver, 0.1-2.0% copper and 86.8-98.8% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.
Type:
Grant
Filed:
August 21, 1986
Date of Patent:
September 22, 1987
Assignee:
J. W. Harris Company
Inventors:
Richard E. Ballentine, Robert M. Henson
Abstract: A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.5-2.0% silver and 90.0-98.5% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.