Patents Assigned to Jack Frost Laboratories, Inc.
  • Patent number: 4920964
    Abstract: A microwavable thermal pack and a method of heating the pack. The thermal pack is a completely sealed envelope constructed from opposed laminate layers, portions of which are joined by sealed seams. The layers define an inner chamber within which is disposed a heat transfer material. Each of the laminate layers includes a pair of co-extensive inner and outer films contacting each other throughout their surface areas. The films are selected so that the laminate layers of the thermal pack do not pass the heat transfer material during heating of the heat transfer material within the thermal pack which is equivalent to the energy developed by a microwave device operating at full power for a period of time greater than about one minute but less than about four minutes.
    Type: Grant
    Filed: May 31, 1988
    Date of Patent: May 1, 1990
    Assignee: Jack Frost Laboratories, Inc.
    Inventor: Sam E. Francis, Jr.
  • Patent number: 4756311
    Abstract: Microwavable instant and/or cold pack gel package including an envelope fabricated from a laminate, for example, of films of synthetic resins and an aqueous gel in said envelope.
    Type: Grant
    Filed: May 15, 1985
    Date of Patent: July 12, 1988
    Assignee: Jack Frost Laboratories, Inc.
    Inventor: Sam E. Francis, Jr.