Patents Assigned to Jae Kwan Kim
  • Publication number: 20010029711
    Abstract: Disclosed is a seismic load transmitting system based on impact mechanism for a multi-span continuous bridge, comprising impact assemblies connected to a superstructure of the bridge for colliding with movable support piers according to a longitudinal displacement of the superstructure of the bridge caused by a seismic load and transmitting the seismic load from the superstructure of the bridge to the movable support piers; and impact receiving assemblies installed in the movable support piers for receiving an impact force generated when the movable support piers become collided with the impact assemblies and transmitting the seismic load transferred from the superstructure of the bridge through the impact assemblies to the movable support piers, wherein the seismic load generated in the superstructure of the bridge is transmitted not only to the fixed support piers but also to the moving support piers due to the collision between the impact assemblies and the impact receiving assemblies; and wherein the cont
    Type: Application
    Filed: April 9, 2001
    Publication date: October 18, 2001
    Applicant: Jae Kwan Kim
    Inventors: Jae Kwan Kim, Ick Hyun Kim